Electronic Component Metal Frame Bonding Strength
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Solution Overview
Problem
Multilayer capacitors used in electronic components for vehicles face issues with bonding strength between external electrodes and metal frames due to differences in thermal expansion coefficients, leading to weakened bonding and defects like delamination and cracks under temperature changes.
Innovation Solution
The electronic component design includes first and second metal frames with support and mounted portions bonded to external electrodes, where the bonding area between the head portions and support portions is optimized within a specific ratio (0.2A≤B≤0.8A) to maintain bonding strength, using conductive bonding layers and strategically placed openings to enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a metal frame is used to mount the multilayer capacitor at a spaced distance from the board, then vibration resistance is improved, but bonding strength at the bonding interface is weakened due to difference in coefficients of thermal expansion between the external electrode and the metal frame
Solution Approach 1:
The patent optimizes the bonding area parameter by controlling the ratio between the head portion area (A) and the bonding region area (B) within 0.2≤B/A≤0.8. This parameter optimization ensures sufficient bonding strength while accommodating thermal expansion differences between the external electrode and metal frame, preventing delamination and cracks under temperature cycling conditions.
2Strength
If the bonding area between the external electrode and metal frame is increased, then bonding strength is improved, but thermal expansion stress concentration increases leading to delamination and cracks
Solution Approach 1:
The patent establishes an optimal bonding area ratio range of 0.2≤B/A≤0.8 between the head portion area (A) and bonding region area (B). This optimized parameter prevents both insufficient bonding strength and excessive thermal expansion stress concentration, thereby avoiding delamination and cracks while maintaining reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains a bonding strength of 15N or more at the interface, preventing defects such as delamination and cracks, even under repetitive temperature cycles, thus ensuring the electronic component's reliability and durability.
Implementation Method 1
first and second metal frames, the first metal frame including a first support portion bonded to the first head portion
Data Source
AI summary
An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A≤B≤0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.