Electronic Component Module with Electroless Plated Side Shielding
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Solution Overview
Problem
Existing electronic component modules suffer from low electromagnetic wave shielding effectiveness and reduced manufacturing efficiency due to incomplete coverage of electromagnetic wave shields on substrates and the need for manual application of metal caps, which limits batch production.
Innovation Solution
An electronic component module design featuring a substrate with a space section on its opposite surface, allowing for electroless plating of a metal film that covers all side surfaces except where the space section is formed, improving shielding and enabling easier detachment from a sheet member for increased manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal cap is used to cover the top surface and side surfaces of the substrate, then electromagnetic wave shielding is improved, but the manufacturing efficiency is lowered due to the need for manual application after each module is manufactured
Solution Approach 1:
The patent applies preliminary action by forming the metal film on the substrate before mounting electronic components and applying the insulating body. The substrate is placed on a sheet member, and the metal film is formed in advance to cover the side surfaces. This allows batch processing of multiple modules simultaneously, improving manufacturing efficiency while maintaining electromagnetic wave shielding effectiveness.
2Object-affected harmful factors
If the periphery of the semiconductor chip is covered with an electromagnetic wave shield, then electromagnetic wave leakage is prevented, but the side surfaces of the substrate remain uncovered resulting in low shielding effect
Solution Approach 1:
The patent extends electromagnetic wave shielding from the traditional two-dimensional planar coverage to three-dimensional coverage by forming the metal film to wrap around the side surfaces of the substrate. The metal film is applied in a manner that covers not only the top surface periphery but also extends down the vertical side surfaces, providing comprehensive multi-dimensional shielding against electromagnetic wave leakage.
3Reliability
If the substrate is covered with an electromagnetic wave shield up to the side surfaces, then shielding effectiveness is improved, but the metal film forms on the sheet member requiring complex removal processes
Solution Approach 1:
The patent applies segmentation by creating a distinct boundary between the metal film coverage area and the sheet member contact area. The metal film is formed to cover the side surfaces of the substrate but stops before reaching the sheet member surface. This segmentation prevents metal film formation on the sheet member, allowing for easy detachment of the finished module from the sheet member without complex removal processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances electromagnetic wave shielding by covering all side surfaces with a metal film and improves manufacturing efficiency by preventing the metal film from forming on the sheet member, allowing for easier detachment and batch production.
Implementation Method 1
a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate
Data Source
AI summary
The electronic component module includes a substrate; an electronic component mounted on an electronic component mounting surface of the substrate; an insulating body that covers the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate. The substrate has a space section in which a space is formed, the space being dented inward of the substrate in the periphery of a surface opposite to the electronic component mounting surface of the substrate, and the metal film entirely covers at least one side surface of the electronic component module except for at least a portion located on a surface perpendicular to the electronic component mounting surface of the substrate in the space section.