Electronic Component with Recessed Baked Electrodes
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Solution Overview
Problem
The reduction in size and height of electronic components, such as multilayer ceramic capacitors, leads to a reduced bonding area between baked electrodes and the component body, increasing the risk of peeling when external forces are applied.
Innovation Solution
The formation of a recess between baked electrodes on the electronic component's mounting surface, which extends into the component body and can include a ceramic layer, increases the fixing area and reduces the risk of peeling by enhancing the bonding strength through a larger contact area and the use of conductive and ceramic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size and height of electronic components are reduced, then the component becomes more compact and suitable for multi-terminal arrangement, but the bonding area between baked electrodes and component body is reduced, increasing the risk of peeling under external force
Solution Approach 1:
The invention transitions from a two-dimensional bonding surface to a three-dimensional bonding structure by forming a recess that extends into the component body. This allows the baked electrode to be partially embedded within the component, increasing the bonding interface from a flat surface to a multi-faceted three-dimensional structure with greater surface area and mechanical interlocking capability.
Solution Approach 2:
The baked electrode is nested within the recess formed in the component body, creating a hierarchical structure where the electrode is partially contained within the component. This nesting arrangement maximizes the bonding interface area while maintaining a compact external profile, effectively increasing strength without proportionally increasing overall component volume.
2Productivity
If the bonding area is reduced due to component size reduction, then manufacturing becomes simpler and more compact, but the fixing force between baked electrode and component body decreases, leading to peeling under load
Solution Approach 1:
The recess is formed in advance during the component manufacturing process, before the baked electrode is applied. This preliminary preparation of the bonding interface allows for optimized electrode placement and maximizes bonding surface area without adding subsequent complex manufacturing steps, thereby maintaining manufacturing efficiency while improving reliability.
3Strength
If a recess is formed extending into the component body over the baked electrodes, then the fixing area is increased and peeling is suppressed, but the structural complexity of the component increases
Solution Approach 1:
The component body is segmented to form a recess that creates distinct zones: an exposed upper surface area and an internal recess area. This segmentation allows the baked electrode to interact with both surfaces, maximizing bonding area while organizing the structure into functional zones that can be manufactured using standard techniques for ceramic electronic components.
Data Source
AI summary
An electronic component includes an electronic component main body having a mounting surface with first and second baked electrodes located thereon at locations spaced apart from one another. A recess extends into the electronic component main body in the area between the first and second baked electrodes. The recess extends over at least a part of at least one of the first and second baked electrodes.