Electronic Component Conductive Resin Layer Crack Suppression
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Solution Overview
Problem
Existing electronic components with conductive resin layers face challenges in suppressing cracks under external force without increasing component size, as thicker resin layers lead to larger components and potential short circuits due to solder bridges.
Innovation Solution
The electronic component design features a conductive resin layer that covers one principal surface and side surfaces, with a maximum width portion in the center, allowing the resin layer to absorb stress while minimizing size increase and preventing protrusion, thus reducing crack occurrence and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the conductive resin layer is increased to suppress crack occurrence in the element body, then the crack suppression effect is improved, but the size of the electronic component increases
Solution Approach 1:
The conductive resin layer is selectively applied only to specific regions of the element body - covering the principal surface and side surfaces where external force and stress concentration occur during solder-mounting. This localized application provides crack suppression functionality exactly where needed without unnecessarily increasing component size in regions where protection is not required.
Solution Approach 2:
The conductive resin layer extends in multiple dimensions - covering not only the top principal surface but also wrapping around the side surfaces. This multi-dimensional coverage distributes the stress absorption function across different spatial dimensions, providing effective crack suppression while maintaining compact overall dimensions.
2Strength
If the conductive resin layer covers the maximum width portion of the element body, then the stress absorption capability is improved, but the resin layer protrudes outward increasing component width
Solution Approach 1:
The conductive resin layer is positioned asymmetrically relative to the element body's maximum width portion. By locating the maximum position of the resin layer closer to one principal surface than the maximum width portion, the design creates an asymmetric configuration that provides effective stress absorption while preventing the resin from protruding outward beyond the element body's boundaries.
Solution Approach 2:
The conductive resin layer acts as an intermediary material between the element body and the external solder fillet. It is strategically positioned to cover the side surfaces and principal surface where stress concentration occurs, absorbing external force before it reaches the element body, thereby protecting against cracks without requiring the resin to extend to the maximum width portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses crack formation and prevents short circuits by absorbing external stress without increasing the component's size, ensuring reliable mounting and low equivalent series inductance (ESL) while maintaining a compact form.
Implementation Method 1
the conductive resin layer absorbs stress acting on the element body
Data Source
AI summary
An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.