Built-In Electronic Component Substrate: Irregular Layouts for Strength
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Solution Overview
Problem
Substrates with built-in electronic components often have reduced strength due to the integration of electronic components, necessitating an increase in structural integrity.
Innovation Solution
A substrate design with irregularly oriented rectangular electronic components and cavities or encapsulating material, ensuring the electronic components are irregularly disposed and connected via conductors, which distributes stress and enhances structural rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are built into the substrate, then the substrate integrates functional components, but the strength of the substrate decreases
Solution Approach 1:
The patent applies asymmetry by irregularly disposing rectangular electronic components on the substrate rather than using a regular grid pattern. This irregular arrangement prevents stress concentration that would occur with symmetric layouts, thereby maintaining substrate strength while integrating multiple electronic components with different electrodes extending in different directions
2Ease of manufacture
If electronic components are arranged regularly, then manufacturing is simplified, but stress concentration occurs reducing substrate strength
Solution Approach 1:
The patent deliberately uses asymmetric, irregular arrangement of rectangular electronic components instead of regular patterns. This prevents stress concentration points that would arise from repetitive regular layouts, while still maintaining manufacturing feasibility through standardized component shapes and systematic connection methods
3Area of stationary object
If electronic components are densely packed, then substrate area utilization increases, but structural integrity and rigidity decrease
Solution Approach 1:
The irregular asymmetric arrangement allows electronic components to be densely packed while maintaining structural integrity. The non-uniform distribution creates varied spacing patterns that prevent stress concentration, and the different orientations of rectangular components distribute mechanical loads more effectively than regular dense packing
Solution Approach 2:
The patent utilizes two-dimensional irregular arrangement of rectangular components with different orientations, effectively using both planar dimensions to maximize area utilization while the varied orientations provide three-dimensional stress distribution benefits, maintaining structural integrity despite high component density
Data Source
AI summary
A substrate with built-in electronic components includes an insulator having a first surface and a second surface facing away from the first surface, and a plurality of electronic components built into the insulator, in which each of the electronic components includes a first electrode disposed in a first direction toward the first surface of the insulator and a second electrode disposed in a second direction opposite to the first direction, the electronic components is rectangular in top view from a first surface side, and rectangles of the plurality of electronic components on the first surface side in top view from the first surface side are irregularly disposed.