Printed Circuit Aspects TRIZ Cases

Vias and soldered interposers route signals and support back-firing microphones without relying on humidity-sensitive adhesive attachment.

This case uses a coating layer around larger electrode pads to preserve circuit-board attachment during thermal or drop impact.

A multi-material 3D printing process adds conformal thermal traces that spread heat from PCB hot spots without electrical shorting.

Assembly option modules configure one PCB for D-PHY or C-PHY routing while preserving mode-specific signal integrity and impedance matching.

This case uses peripheral over resist and a resist opening to position components while preserving central heat transfer.

This case uses irregularly oriented rectangular components to distribute stress and reduce warping in built-in electronic substrates.

Aluminum oxide, boron nitride, and fullerene layers enable passive radiation cooling, reducing component temperatures by 3–10°C.

This cooling structure compresses the heat conductive member while isolating fixing stress from the printed circuit board and solder joints.

Air-drying, freezing, and thawing create conductive gel circuits compatible with hydrogels for stable bioelectronics.

Trace component carriers with laterally and vertically displaced information structures.

This case shows how assembly option modules support C-PHY and D-PHY routing on one PCB while controlling signal integrity and costs.

A base substrate uses opposing extending portions to support the panel between housing walls and simplify assembly.

Remote power phases and busbars shorten signal paths near telecom ASICs.

Slotted posts improve PCB differential impedance continuity and reduce insertion loss.

A reinforcing plate and stepped bump structure support the image sensor, reducing adhesive warpage and preserving pixel-region flatness.

This case combines maleimide, cyanate ester, and modified polyphenylene ether resins for moisture-resistant, thermally stable PCB materials.

A two-sheet cover panel pairs ultra-thin glass with a high-modulus sheet to resist cracks, impact, and curling.

This case uses segmented orthogonal metal-wire electrodes to prevent closed electric force lines and preserve touch-panel visibility.

A dicyclopentenyl active ester curing agent helps epoxy boards combine low dielectric properties with copper peel and interlayer strength.

Complementary surface roughness lets a carrier protect thin PCBs from damage and warpage during adhesive-free semiconductor packaging.

This PCB uses asymmetric insulating layers around a cavity to reduce thickness, limit panel cracking, and support fine wiring.

Using SDF and BRDF modeling, this case adds low-cost 3D solder-joint reconstruction to conventional 2D AOI inspection.

An inorganic layer covers the organic protective layer, limiting moisture release during heat or low-pressure display processing.

Grooved, chamfered fins reduce thermal resistance near the air outlet while integrated connections shorten circuit-board assembly.

Laser or projector exposure adapts the layout to the detected substrate position, reducing film errors, energy use, and preparation time.

Learn how a cavity-mounted support body constrains a work vehicle wear sensor for continuous, damage-resistant monitoring.

A clad PCB structure combines copper heat conduction with aluminum oxidation protection, reducing reliance on costly plating.

Open-ended moats and perforations isolate active areas, preserving pressure accuracy as the flexible substrate stretches.

Pre-treated hub zones enable physical separation into functional units while data, power, and ground buses preserve electrical connectivity.

A protrusion-and-groove guide aligns FPCB and ceramic feed-through electrodes, reducing manual bonding time and equipment needs.

This case assigns only the needed fiducial marks by X/Y position, balancing mounting accuracy with faster mark reading.

Laser-drilled, copper-filled trenches and buried vias expand PCB conduction paths, reducing DC resistance without thicker planes.

Tapered metal supporting layers distribute stress at wiring ends, preserving flexibility while reducing crack risk.

A housing-fixed PCB uses a cuttable connection to position the sensor accurately while reducing current consumption and module size.

Edge binding layouts keep tiled panels aligned for simpler, consistent driving.

A wiring circuit board uses thinner end portions and a thicker body to relax stress and improve wire crack resistance.

This wiring board uses obtuse-angle conductor protrusions to disperse resin-expansion stress and reduce cracks and peeling.

Nanoporous conductive layers connect vias in stacked glass circuit boards.

A connector spanning both sides of an insulating substrate is molded in plastic to improve durability, reliability, and visual integrity.

This power module uses substrate guide grooves to contain molten solder, protect insulating layers, and improve bonding reliability.

A selectively molded layer isolates implant electronics, raises resonance frequency, and manages moisture and hydrogen.

This PCB assembly places a covered conductive part in narrow regions to lower impedance, improve current use, and strengthen reliability.

A segmented via and resin-lined hole reduce plating defects and signal loss in thick-dielectric, high-frequency circuit boards.

This case shows how magnetic members enable rapid panel assembly while a third display module shields seams without sacrificing thinness.

This memory-module case routes even and odd DQ bits on separate PCB layers to limit reference changes while preserving simultaneous arrival.

Close card spacing can hinder bottom-screw installation; a rotatable plate shifts the fastening hole for short or long expansion cards.

Learn how a tilted pixel-circuit layout expands light transmission for full-screen displays with integrated photosensitive components.

A two-layer film laminate combines low dielectric loss with controlled 355 nm absorption for precise cutting and circuit-board adhesion.

Modified polyphenylene ether, maleimide, and low-molecular-weight styrene balance moldability with dielectric and thermal performance.

Blocking layers align through holes with electrodes for compact, stable circuit board connections.