Embedded Component Circuit Board with Blocking-Layer Through-Hole Alignment
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Solution Overview
Problem
The size of circuit boards is affected by the size of embedded electronic components, particularly due to the need to increase electrode size for position accuracy, which can also increase the overall board size, and through-hole positioning accuracy impacts the quality of the circuit board.
Innovation Solution
A circuit board design with a blocking layer embedded in the insulating layer, allowing through holes to pass through a portion of the insulating layer connected to the inner sidewall, ensuring the through holes align with electrodes, and using a conductive material to connect electrodes to the outer substrate, enhancing contact area and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the electrode size of the embedded electronic component is increased to avoid position accuracy problems, then the position accuracy is improved, but the overall size of the circuit board increases
Solution Approach 1:
The patent introduces a receiving cavity structure that extends in the vertical dimension (through the substrate thickness) to accommodate the electrode. By utilizing the third dimension (depth/thickness) rather than only the planar dimensions, the electrode can achieve sufficient contact area and positioning accuracy without increasing the overall footprint area of the circuit board.
Solution Approach 2:
The electrode is nested within a receiving cavity that is formed within the substrate layers. The cavity is positioned between different layers of the substrate, allowing the electrode to be embedded within the internal structure rather than occupying external space, thus maintaining compact board dimensions while providing adequate electrode area.
2Reliability
If a through hole is defined in the circuit board to expose the electrodes, then the electrical connection is enabled, but the position accuracy of the through hole affects the overall quality
Solution Approach 1:
The receiving cavity is formed in advance within the substrate before the electrode is installed. This preliminary formation of the cavity structure provides a pre-positioned reference that guides the subsequent through hole drilling, ensuring that the through hole accurately aligns with the electrode even if there are minor positioning deviations during assembly.
Solution Approach 2:
The receiving cavity acts as an intermediary structure between the electrode and the through hole. It provides a mechanical and positional reference that mediates the alignment between the electrode position and the through hole position, compensating for potential positioning errors and ensuring reliable electrical connection.
Data Source
AI summary
A method for manufacturing a circuit board that includes a first electronic component and a circuit substrate is provided. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.