Multi-Material 3D Thermal Traces for PCB Heat Spreading
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Solution Overview
Problem
Existing printed circuit boards (PCBs) face challenges in efficiently dissipating heat due to overheating of electrical components, which can lead to performance degradation and thermal damage, particularly in components with complex structures or small features, where applying thermal interface materials is complicated.
Innovation Solution
A multi-material 3D (MM3D) printing process deposits an electrically-insulating material over open circuitry on PCBs, followed by a thermally-conductive material to create thermal conductive traces that spread heat laterally from hot areas to remote areas, using materials like graphene-flakes composites or carbon nano-fibers, enabling conformal and selective heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material is applied to semiconductor products with complex structures or small features, then heat dissipation is improved, but application complexity and difficulty increase significantly
Solution Approach 1:
The MM3D printing system automatically deposits thermal conductive material precisely where needed on complex semiconductor structures without requiring manual intervention. The system self-adjusts to conform to the complex geometry, eliminating the need for complex application procedures while maintaining effective thermal contact.
Solution Approach 2:
The invention changes the state of thermal interface material application from manual deposition to automated 3D printing. By using MM3D printing technology, the system can deposit material with controlled thickness and precision, transforming the application process into a programmable, repeatable operation that handles complex geometries effectively.
2Temperature
If thermal conductive material is deposited over open circuitry, then heat spreading is improved, but electrical shorting risk increases
Solution Approach 1:
The MM3D printing system applies different material properties in different locations. It deposits electrically insulating material specifically over open circuitry areas where electrical isolation is needed, while using thermally conductive material in areas requiring heat spreading. This local differentiation resolves the contradiction by providing both electrical isolation and thermal management in the same structure.
Solution Approach 2:
The invention uses composite material deposition, combining electrically insulating and thermally conductive properties in a single printed structure. The MM3D printing system can switch between different materials or material compositions during the printing process, creating a composite thermal management layer that simultaneously prevents electrical shorting and enables heat spreading.
3Ease of manufacture
If conventional thermal management methods are used on existing PCBs, then implementation is simple, but thermal management effectiveness is limited
Solution Approach 1:
The invention transitions from planar thermal management to three-dimensional thermal management. The MM3D printing system deposits material in multiple layers and at varying heights, conforming to the actual topography of the PCB and components. This dimensional approach allows thermal conductive traces to follow heat flow paths in three dimensions, significantly improving thermal management effectiveness while remaining implementable on existing PCBs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MM3D printed material effectively addresses heat dissipation limitations by providing conformal thermal conductive traces that prevent electrical shorting and enhance heat spreading, allowing for adaptive thermal management without requiring new PCB designs.
Implementation Method 1
a thermally-conductive material 132B thereover to allow heat flow over the electrically-insulating material 132A
Data Source
AI summary
Systems and methods herein are for a printed circuit board (PCB) having open circuitry and having a three-dimensional (3D) printed material that is deposited in a single process over at least one area of the PCB, where the 3D printed material may include at least a thermally-conductive material to enable at least one thermal conductive trace by the thermally-conductive material being over an electrically-insulating material of the 3D printed material and being over the open circuitry, and where the at least one thermal conductive trace can provide heat spreading from at least one hot area of the PCB to a remote area of the PCB.