Optical Transceiver FPCB Protrusion-Groove Alignment for Bonding

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Solution Overview

Problem

Existing optical transceivers face challenges in achieving high-precision bonding between flexible printed circuit board (FPCB) electrodes and feed-through electrodes, leading to impedance mismatches and increased costs due to manual alignment processes.

Innovation Solution

The implementation of a protrusion portion on the FPCB and a corresponding insertion groove or guide groove in the feed-through structure for precise alignment of FPCB electrodes and feed-through electrodes, allowing for automated alignment and reduced bonding time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If manual alignment operation is used for bonding FPCB electrodes to feed-through electrodes, then alignment precision can be achieved, but time consumption and labor costs increase

Engineering Contradiction:
Improvealignment precisionVSAvoidbonding time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The FPCB structure includes protrusion portions that automatically insert into insertion grooves on the feed-through structure during bonding, enabling self-alignment without manual intervention. This self-service mechanism eliminates the need for skilled workers to manually align electrodes, reducing both time consumption and labor costs while maintaining alignment precision.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The protrusion portions and insertion grooves act as intermediary alignment features that facilitate precise positioning between the FPCB and feed-through structure. These intermediary elements guide the bonding process by providing physical constraints that ensure accurate electrode alignment before bonding occurs.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If separate process equipment is used for bonding FPCB electrodes to ceramic feed-through electrodes, then alignment precision improves, but equipment costs and process complexity increase

Engineering Contradiction:
Improvealignment precisionVSAvoidprocess equipment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The alignment function is merged into the FPCB and feed-through structure themselves through the protrusion-insertion groove mechanism. This eliminates the need for separate alignment equipment or complex positioning systems, as the structures provide their own alignment capability through integrated geometric features.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bonding process utilizes the self-alignment capability provided by the protrusion portions and insertion grooves, eliminating the need for external alignment equipment. The structures serve themselves by providing built-in alignment features that work during the standard bonding process without requiring additional specialized machinery.

Inventive Principle:
Principle #25Self-service

3Ease of operation

If manual alignment depending on worker skill level is used, then flexibility is maintained, but consistency and precision vary

Engineering Contradiction:
Improveoperational flexibilityVSAvoidalignment consistency
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The protrusion-insertion groove mechanism provides automatic self-alignment that eliminates dependence on worker skill levels. The geometric constraints ensure consistent and precise alignment every time, regardless of the operator's expertise, thereby improving alignment consistency while maintaining ease of operation.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The protrusion portions and insertion grooves serve as intermediary alignment features that standardize the bonding process. These features provide consistent geometric constraints that ensure uniform alignment quality across different operators and production batches, eliminating variability associated with manual skill differences.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12375179B2Optical transceiver for high-precision bonding of flexible printed circuit board and ceramic feed-through structure and package structure
Publication Date: 2025.07.29 ELECTRONICS & TELECOMM RES INST
  • US12375179B2 patent drawing
  • US12375179B2 patent drawing
  • US12375179B2 patent drawing

AI summary

An optical transceiver is provided. A transceiver optical sub-assembly included in the optical transceiver includes a package body, accommodating optical devices and including a front surface coupled to an optical signal terminal, and a feed-through structure closing a rear surface of the package body and an open portion provided at both side surfaces adjacent to the rear surface. A disposition portion where one end of a flexible printed circuit board (FPCB) is disposed is provided at a front surface of the feed-through structure. Feed-through electrodes bonded to FPCB electrodes provided at the one end of the FPCB are provided on a surface of the disposition portion. For precise alignment of the FPCB electrodes and the feed-through electrodes, a protrusion portion is provided at the one end of the FPCB, and an insertion groove into which the protrusion portion is inserted is formed in a front surface of the feed-through structure.