Wiring Circuit Board Thickness Gradient to Prevent Wire Cracks
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Solution Overview
Problem
The existing wiring circuit boards experience stress concentration and potential cracking at the end portions of the wiring due to the larger thickness of the wiring portions, leading to possible wire cracks.
Innovation Solution
The wiring circuit board design includes thinner first and second portions connected to support portions, with these portions being 0.1% to 25% of the total wire length and 50% to 100% of the body portion width, to distribute stress and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the wiring portion has a larger thickness than width, then the wiring portion can be easily moved in the width direction, but stress concentrates at the end portion causing wire cracks
Solution Approach 1:
The wire is designed with non-uniform thickness: a first portion with smaller thickness at the end connected to the support portion, and a body portion with larger thickness in the middle. This local variation in thickness allows the end portion to flex more easily (improving movability) while the thicker body portion maintains strength (preventing cracks).
Solution Approach 2:
The thinner first portion acts as a stress-absorbing element that preemptively reduces stress concentration at the critical end portion where wires are most vulnerable to cracking during wiring operations. This design anticipates and mitigates the harmful stress concentration before it can cause damage.
2Ease of manufacture
If the wire thickness is uniform throughout, then the manufacturing process is simpler, but stress concentration occurs at the end portion
Solution Approach 1:
The wire incorporates a localized thickness variation with a thinner first portion at the end and a thicker body portion in the middle. This non-uniform structure creates a gradual transition that distributes stress more evenly, preventing concentration at the end portion while remaining compatible with standard manufacturing processes.
3Stress or pressure
If the first portion of the wire is made thinner, then stress on the wire at the end portion is reduced, but the wire may become more vulnerable to damage
Solution Approach 1:
The wire features a thickness gradient where the first portion at the end is thinner to reduce stress concentration, while the body portion in the middle is thicker to provide overall strength and rigidity. This localized differentiation optimizes both stress distribution and mechanical strength.
Solution Approach 2:
The thinner first portion serves as a stress-absorbing buffer that reduces peak stresses at the vulnerable end portion before they can propagate to the thicker body portion, protecting the overall wire structure from fatigue and cracking.
Data Source
AI summary
A wiring circuit board includes a plurality of wiring portions, a first support portion supporting one end portion of each of the wiring portions, and a second support portion supporting the other end portion of each of the wiring portions. Each of the wiring portions and has a wire. The wire has a first portion connected to the first support portion, a second portion connected to the second support portion, and a body portion disposed between the first portion and the second portion. The first portion and the second portion are thinner than the body portion.