Maleimide Resin Composition for Low-Water-Absorption PCBs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing resin compositions for printed wiring boards do not adequately address the need for low water absorption, dielectric properties, and thermal resistance required by modern semiconductor technologies.
Innovation Solution
A resin composition containing a compound represented by Formula (M1) with two maleimide groups and a fused ring structure, combined with a compound having two or more unsaturated carbon-carbon double bonds, along with optional additional resin components, to form a cured product with improved low water absorption and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin compositions are used for printed wiring boards, then basic electrical and mechanical properties are achieved, but water absorption increases and thermal resistance decreases
Solution Approach 1:
The patent employs a composite resin composition comprising multiple components: a cyanate ester resin (Procion H-15), a polymaleimide resin (BMI-2300), and a modified poly(phenylene ether) resin (OPE-2St1200 with vinylbenzyl groups). This composite approach combines the low water absorption characteristics of cyanate esters with the thermal stability of maleimides and the adhesion properties of phenylene ether, achieving superior overall performance that single materials cannot provide.
Solution Approach 2:
The patent modifies the poly(phenylene ether) resin by introducing vinylbenzyl groups at the terminal positions, changing its chemical parameters to include reactive unsaturated groups. This parameter change enables the resin to participate in crosslinking reactions, improving network density and reducing water absorption while maintaining processingability and adhesion properties.
2Reliability
If resin composition is optimized for low water absorption, then moisture resistance improves, but dielectric properties and thermal resistance may deteriorate
Solution Approach 1:
The composite resin system combines cyanate ester resin (providing low water absorption), polymaleimide resin (providing high thermal resistance and desmear resistance), and modified poly(phenylene ether) resin (providing adhesion and dielectric properties). The synergistic interaction of these three materials achieves simultaneous optimization of water absorption, thermal resistance, and dielectric properties that cannot be obtained from single materials.
Solution Approach 2:
Each resin component is strategically selected to provide specific local functions within the crosslinked network: cyanate ester units provide low water absorption pathways, maleimide units provide thermal stability and desmear resistance, and phenylene ether units provide adhesion and dielectric properties. This local functional distribution allows the material to meet multiple performance requirements simultaneously.
3Reliability
If multiple resin components are combined to achieve low water absorption, then moisture resistance improves, but manufacturing complexity increases
Solution Approach 1:
The modified poly(phenylene ether) resin is designed with specific parameters: molecular weight of 1200-2000, vinylbenzyl group content of 1-10 mmol/g, and terminal functionality. These controlled parameter changes ensure the resin behaves predictably in the composite system, simplifying formulation and processing despite the multi-component nature of the composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent low water absorption and maintains dielectric properties, even after moisture absorption, while providing high thermal resistance and handling properties, suitable for advanced semiconductor applications.
Implementation Method 1
a resin composition containing a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds
Data Source
AI summary
Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group: