Implantable Medical Device Dampening Layer for PCBA Vibration Reduction
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Solution Overview
Problem
Relative motion between electrical components within implantable medical devices leads to interconnect issues and potential failures, necessitating a solution to reduce vibration and improve device reliability.
Innovation Solution
Incorporating a dampening layer, such as a thermoplastic elastomer or hot melt polymer, molded over the printed circuit board assembly (PCBA) to provide mechanical and electrical isolation, while omitting coverage over certain components like batteries and capacitors, and integrating desiccant and hydrogen getter materials within the moldable material to enhance moisture and hydrogen management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dampening layer is molded over the PCBA to reduce vibration and internal motion, then reliability and mechanical robustness are improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The dampening layer integrates multiple functions into a single component: vibration dampening, electrical isolation, mechanical fixation of components, and moisture/hydrogen management through impregnated materials. This merging reduces the need for separate components and assembly steps, ultimately decreasing overall device complexity while improving reliability
Solution Approach 2:
The dampening layer serves as a multi-functional element that simultaneously provides mechanical dampening, electrical insulation, component mounting, and environmental protection. This universal approach consolidates multiple protective and structural roles into one element, resolving the contradiction between improved reliability and increased complexity
2Strength
If a dampening layer is molded over the PCBA to reduce vibration, then mechanical robustness is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process combines multiple operations into a single molding step: vibration dampening, electrical isolation, and mechanical fixation are all achieved in one molding operation. The impregnation of desiccant and hydrogen getter materials is integrated into the molding process, reducing the number of separate manufacturing steps and maintaining ease of manufacture while improving mechanical robustness
3Reliability
If the dampening layer provides electrical isolation to electrical components, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The molding process simultaneously achieves mechanical dampening, electrical isolation, and component fixation in a single operation. The elastomeric material inherently provides electrical insulation properties while being molded over the PCBA and components, eliminating the need for separate electrical isolation steps and maintaining manufacturing simplicity
Solution Approach 2:
The selection of elastomeric materials with specific properties (electrical insulation, dampening characteristics, adhesion properties) allows a single material to fulfill multiple functions. By changing material parameters rather than adding functional layers, the patent maintains ease of manufacture while achieving reliable electrical isolation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dampening layer significantly reduces internal motion, increases resonance frequency, and enhances mechanical robustness, minimizing connector stress and failure risks, while also improving moisture and hydrogen management within the device.
Implementation Method 1
a dampening layer selectively molded onto and attached to the first plurality of electrical components, the dampening layer providing electrical isolation to the first plurality of electrical components and configured to reduce susceptibility to vibration
Implementation Method 2
The dampening layer is impregnated with a desiccant
Implementation Method 3
The dampening layer is impregnated with a hydrogen getter material
Data Source
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AI summary
An implantable medical device may include a plurality of electrical components connected to form operational circuitry, a canister shaped for housing the operational circuitry, and a dampening layer configured to reduce internal motion between the operational circuitry and at least one of a plurality of additional component within the canister, the dampening layer selectively disposed over the operational circuitry but not over the at least one additional component, the dampening layer providing electrical isolation to the operational circuitry, the dampening layer comprising a moldable material in direct contact with an inner surface of the canister. Methods of manufacturing such a medical device are also disclosed.