PCB Assembly with Parallel Conductive Path for Narrow Regions
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Solution Overview
Problem
Printed circuit boards (PCBs) experience impedance bottlenecks and mechanical reliability issues, particularly in narrow regions, leading to reduced electrical performance and increased risk of board breakage.
Innovation Solution
Incorporation of a conductive part connected in parallel to the functional network of the PCB, accompanied by a cover-shaped structure that isolates it from surrounding metal parts, reducing impedance and enhancing mechanical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the printed circuit board is designed with narrow regions to adapt to internal space and component arrangement, then the adaptability of the PCB layout is improved, but the impedance increases and mechanical reliability deteriorates
Solution Approach 1:
The PCB is divided into a narrow region and a wide region, with the conductive part specifically placed in the narrow region to address impedance issues locally while maintaining overall layout adaptability
Solution Approach 2:
A composite structure is formed by combining the conductive part (made of conductive material) with the insulating cover-shaped structure, creating a multi-functional component that simultaneously addresses electrical and mechanical issues in the narrow region
2Adaptability or versatility
If the printed circuit board includes narrow regions, then the layout flexibility is improved, but the impedance bottleneck increases
Solution Approach 1:
The conductive part is specifically applied to the narrow region where impedance is problematic, providing localized impedance reduction without affecting other regions of the PCB
Solution Approach 2:
The conductive part extends in a direction substantially perpendicular to the signal transmission direction, creating a parallel path that reduces impedance by providing an additional current flow dimension
3Use of energy by moving object
If the conductive part is exposed without isolation, then the current utilization is improved, but the risk of short circuit increases
Solution Approach 1:
The cover-shaped structure made of insulating material serves as an intermediary between the conductive part and surrounding metal parts, preventing direct contact and short circuits while allowing the conductive part to maintain its current-carrying function
Solution Approach 2:
The cover-shaped structure acts as an insulating shell that encloses the conductive part, providing physical isolation and preventing short circuits while maintaining the electrical functionality of the conductive part
4Use of energy by moving object
If the conductive part is added to reduce impedance, then the current utilization is improved, but the device complexity increases
Solution Approach 1:
The conductive part and the cover-shaped structure are combined into a single integrated component assembly, where the conductive part provides electrical functionality and the cover-shaped structure provides both mechanical support and electrical isolation
Solution Approach 2:
The cover-shaped structure serves multiple functions simultaneously: it provides mechanical support to the narrow region of the PCB, isolates the conductive part from surrounding metal parts to prevent short circuits, and maintains the electrical functionality of the conductive part
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces impedance, improves current utilization, and enhances mechanical reliability by providing a path for current while preventing short circuits, thereby lowering circuit board temperature and improving heat dissipation.
Implementation Method 1
the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network... the conductive part may transmit a current... impedance of the circuit board can be reduced
Implementation Method 2
the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure
Implementation Method 3
heat generated is accordingly reduced, and a current utilization can be improved. Further, heat generated by the circuit board is reduced, and a temperature of the circuit board decreases
Data Source
AI summary
This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.