PCB Structure with Composite Radiation Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Traditional circuit board cooling technologies rely heavily on metal cooling fins, which are space-consuming and require high power for air convection, limiting effective heat dissipation and occupying valuable space.

Innovation Solution

Incorporation of an aluminum oxide-boron nitride-fullerene composite material in the solder mask layer and adhesive insulation layer for radiation heat transfer, enhancing heat dissipation without increasing board size or power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metal cooling fins are used for heat dissipation, then heat dissipation capability is improved, but space consumption increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidboard space

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent replaces the mechanical heat dissipation system (metal cooling fins requiring physical space) with a radiation-based heat dissipation system using aluminum oxide-boron nitride-fullerene composite material. This substitution eliminates the need for bulky mechanical cooling structures while achieving effective heat dissipation through thermal radiation properties of the composite material.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs aluminum oxide-boron nitride-fullerene composite material integrated into the PCB substrate to achieve heat dissipation. This composite material combines the thermal radiation properties of aluminum oxide, the thermal stability of boron nitride, and the unique structure of fullerene, enabling effective heat dissipation without requiring additional space-consuming cooling components.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the number of cooling fins is increased to meet higher heat dissipation requirements, then heat dissipation capability is improved, but power consumption increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidpower consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent replaces the mechanical convection-based cooling system (requiring fans or forced air flow) with a passive radiation-based heat dissipation system. The aluminum oxide-boron nitride-fullerene composite material enables heat dissipation through thermal radiation without requiring external power sources, thereby eliminating the energy consumption associated with active cooling systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If metal cooling fins are used for heat dissipation, then heat dissipation capability is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation function directly into the PCB substrate by integrating the aluminum oxide-boron nitride-fullerene composite material into the board structure. This eliminates the need for separate cooling fins and associated mounting hardware, simplifying the overall device structure while maintaining effective heat dissipation capability.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significant temperature reduction of 3 to 10 degrees Celsius, particularly for high-temperature components, achieved through improved radiation heat dissipation.

Implementation Method 1

At least one of the material compositions of the solder mask layer and the adhesive insulation layer, includes an aluminum oxide-boron nitride-fullerene composite material, to transmit heat from the substrates to the outside of the substrate by radiation heat transfer

Methodology Applied

Scientific EffectRadiation heat transfer: Thermal Radiation

Implementation Method 2

the heat dissipation from the circuit board, is mainly achieved by heat conduction between the circuit board and the cooling fins

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

and by heat convection between the cooling fins and neighboring air for the heat dissipation

Methodology Applied

Scientific EffectHeat convection: Convection

Data Source

PatentUS20250254787A1PCB structure with heat dissipation function

Publication Date: 2025.08.07 TAIWAN RUOMEI TECH CORP

AI summary

A printed circuit board (PCB) structure with heat dissipation function, includes: at least one substrate, which includes a first substrate including a first primer material and a first electronic conductive layer disposed on the first primer material; and a solder mask layer, disposed on the electronic conductive layer; wherein when the at least one substrate includes the first substrate and a second substrate, the PCB structure further includes an adhesive insulation layer connected between the first substrate and the second substrate. At least one of the material compositions of the solder mask layer and the adhesive insulation layer, includes an aluminum oxide-boron nitride-fullerene composite material, to transmit heat from the substrates to the outside of the substrate by radiation heat transfer.