Modified Polyphenylene Ether Resin for Low-Dielectric Moldable Laminates
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Solution Overview
Problem
Current substrate materials for printed wiring boards face challenges in achieving low dielectric constant and loss tangent, high glass transition temperature, low water absorption, and excellent moldability, while maintaining adhesiveness and heat resistance, especially in humid environments.
Innovation Solution
A resin composition comprising a modified polyphenylene ether compound with a carbon-carbon unsaturated double bond, a maleimide compound with multiple N-substituted maleimide groups, and a styrene-based polymer with a weight average molecular weight less than 10,000, which enhances moldability, dielectric properties, and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a styrene-based thermoplastic elastomer with relatively large molecular weight is added to improve dielectric characteristics, then low dielectric constant and low dielectric loss tangent are achieved, but moldability is impaired
Solution Approach 1:
The patent changes the molecular weight parameter of the styrene-based thermoplastic elastomer from large to small (less than 10,000), which fundamentally alters the balance between dielectric performance and moldability. This parameter change enables the resin composition to achieve both low dielectric characteristics and good moldability simultaneously
Solution Approach 2:
The patent creates a composite resin composition by combining modified polyphenylene ether compound, maleimide compound, and styrene-based thermoplastic elastomer with controlled molecular weight. This composite approach allows the material to integrate the low dielectric properties of the elastomer with the good moldability provided by the carefully selected molecular weight range
2Reliability
If resin composition is used to achieve low water absorption and high heat resistance, then cured product performance is improved, but moldability in prepreg and semi-cured products deteriorates
Solution Approach 1:
The patent optimizes the molecular weight parameter of the styrene-based thermoplastic elastomer to less than 10,000, which significantly improves moldability while maintaining the heat resistance and low water absorption characteristics through the carefully balanced resin composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a prepreg and metal-clad laminate with improved moldability, low dielectric characteristics, high glass transition temperature, low thermal expansion, and low water absorption, ensuring reliable performance in humid conditions.
Implementation Method 1
a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end
Implementation Method 2
a maleimide compound having two or more N-substituted maleimide groups in one molecule
Implementation Method 3
a styrene-based polymer having a weight average molecular weight of less than 10000
Data Source
AI summary
A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.