Electronic Component Terminal Insulation and Tin Plating
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Solution Overview
Problem
Conventional electronic components face issues with short circuits due to terminal contact with upper substrates or shielding cases, and insulation deterioration during soldering, especially when terminals are formed on multiple surfaces and covered with resin films.
Innovation Solution
The electronic component features terminals formed over end and adjacent surfaces with an insulating film covering the terminal, exposing it only on the mounting surface and applying a tin or tin alloy plating film selectively on the exposed parts to prevent short circuits and insulation damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminals are formed only on the bottom surface of the element body, then short circuit with upper substrate or shielding case is prevented, but the structure inside the element body becomes complicated and characteristics cannot be improved
Solution Approach 1:
The patent applies dimensionality change by forming terminals not only on the bottom surface but also extending onto the side surfaces of the element body. This spatial expansion allows terminals to be positioned away from the upper substrate while maintaining a relatively simple internal structure, resolving the contradiction between preventing short circuits and avoiding structural complexity.
2Reliability
If terminals are formed over bottom surface and side surfaces of the element body, then short circuit with upper substrate is prevented, but the height cannot be reduced
Solution Approach 1:
The patent applies local quality by selectively forming terminals on specific surfaces (bottom and selected side surfaces) rather than uniformly across all surfaces. This localized terminal formation achieves short circuit prevention while optimizing the height dimension, as terminals are positioned only where necessary for electrical connection and short circuit avoidance.
3Reliability
If resin film covers the element body except bottom surface, then terminals are protected, but solder enters through gaps causing destruction of insulating film and deterioration in insulation
Solution Approach 1:
The patent applies the extraction principle by removing the resin film from specific areas where terminals are formed on the side surfaces. This creates intentional gaps that allow solder to access terminals for electrical connection while the resin film remains on other areas to provide insulation and protection, thus preventing solder from penetrating into harmful positions that would destroy the insulating film.
4Volume of moving object
If element body is miniaturized, then distance to upper substrate and adjacent components is reduced, but terminals come into contact with upper substrate or shielding case causing short circuit
Solution Approach 1:
The patent applies dimensionality change by utilizing side surfaces of the element body for terminal formation. This allows terminals to be positioned in the lateral dimension rather than solely in the vertical dimension, effectively increasing the clearance distance between terminals and the upper substrate even when the overall component size is miniaturized, thus preventing short circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents short circuits with substrates or shielding cases and maintains insulation integrity by ensuring the terminal is insulated and solder-resistant, allowing for improved circuit element characteristics without complex internal structures.
Implementation Method 1
a plating film containing tin is formed only on a portion of the terminal exposed from the insulating film
Data Source
AI summary
In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.