Impedence Networks TRIZ Cases

A resonator conductive portion contacts an insulating film to release accumulated electric charges.

A crystal vibrator package uses triangular reinforcing patterns at corner portions to enhance structural rigidity and reduce equivalent series resistance.

A transient liquid phase bonding process joins metal side walls using intermediate alloy layers to secure electronic device substrates.

Folded serial arm with grounded shield conductor reduces electromagnetic coupling between resonators.

Anisotropic wet etching creates symmetry-breaking surface corrugations on silicon substrates to trap light effectively without metal nanostructures.

A quartz resonator substrate with a thickness gradient from edge to center reduces equivalent series resistance by minimizing vibration energy leakage.

Orthogonal frequency codes enable licensed and unlicensed devices to share spectrum without interference.

Integrating impedance matching circuits within the filter package reduces passband loss and footprint by eliminating external components.

Lowering detection Q-factor flattens resonance curves, reducing temperature-dependent sensitivity drift in resonant-type vibration gyroscopes.

A circuit module splitter uses a ground electrode with edge via conductors to redirect leaked transmission signals away from reception electrodes.

A piezoelectric thin film resonator uses a scandium-graded aluminum nitride structure to enhance electromechanical coupling.

Radial signal lines reduce electromagnetic coupling, improving out-of-band attenuation and isolation characteristics in miniaturized devices.

A support layer absorbs bonding stress to prevent cracking, while segmentation enables leak detection for defective devices.

Optimizing electrode thickness and dielectric layers suppresses transverse-mode ripples while expanding the pass band.

Relocating wiring to the sealing member surface frees horizontal space, enabling package downsizing without shrinking the vibrating part.