Impedence Networks TRIZ Cases

A resonator conductive portion contacts an insulating film to release accumulated electric charges.

A crystal vibrator package uses triangular reinforcing patterns at corner portions to enhance structural rigidity and reduce equivalent series resistance.

A transient liquid phase bonding process joins metal side walls using intermediate alloy layers to secure electronic device substrates.

Folded serial arm with grounded shield conductor reduces electromagnetic coupling between resonators.

Anisotropic wet etching creates symmetry-breaking surface corrugations on silicon substrates to trap light effectively without metal nanostructures.

A quartz resonator substrate with a thickness gradient from edge to center reduces equivalent series resistance by minimizing vibration energy leakage.

Orthogonal frequency codes enable licensed and unlicensed devices to share spectrum without interference.

Integrating impedance matching circuits within the filter package reduces passband loss and footprint by eliminating external components.

Lowering detection Q-factor flattens resonance curves, reducing temperature-dependent sensitivity drift in resonant-type vibration gyroscopes.

A circuit module splitter uses a ground electrode with edge via conductors to redirect leaked transmission signals away from reception electrodes.

A piezoelectric thin film resonator uses a scandium-graded aluminum nitride structure to enhance electromechanical coupling.

Radial signal lines reduce electromagnetic coupling, improving out-of-band attenuation and isolation characteristics in miniaturized devices.

A support layer absorbs bonding stress to prevent cracking, while segmentation enables leak detection for defective devices.

Optimizing electrode thickness and dielectric layers suppresses transverse-mode ripples while expanding the pass band.

Relocating wiring to the sealing member surface frees horizontal space, enabling package downsizing without shrinking the vibrating part.

An integrated structure on a compound semiconductor epitaxial substrate reduces signal loss between the power amplifier and acoustic wave device.

Direct laser patterning of glass-insulated metal particles eliminates ground patterns, resolving adhesiveness and productivity trade-offs.

Separating mass adjustment parts from circuit elements prevents laser beam damage during vibration frequency tuning.

A flip-chip acoustic wave device uses a ring-shaped metal layer and metallic sealing member to create an air gap between substrates.

Extending terminals onto side surfaces while applying a selective insulating film prevents short circuits with upper substrates during soldering.

Remote thermal actuation eliminates electrical cross-talk by using laser-generated stress waves to drive the oscillator without direct contact.

A piezoelectric device uses a recessed lower electrode layer with controlled surface roughness to define the active region.

Segmented resilient springs in the isolation platform lower actuation voltage by decoupling stiffness requirements, reducing insertion loss.

Inclined gaps between interdigital transducer fingers minimize propagation loss while suppressing transverse mode spurious waves.

Segmented ring magnetic cores with surrounding ground terminals improve damping characteristics while minimizing leak current in medical instruments.

Glass paste fills gaps around granular conductors in ceramic through holes, preventing air permeability while maintaining electrical conductivity.

Resonating acoustic structures in the pixel defining layer form slits to disconnect adjacent charge generating layers.

Through-substrate vias enable vacuum diffusion bonding of a capping substrate to seal the MEMS cavity, eliminating conventional passivation layers.

Segmented multi-layer shell structure prevents polysilicon accumulation and shell bending under pressure, maintaining vacuum integrity and measurement accuracy.

Residual film stress gradients deflect MEMS resonators out of plane, eliminating squeeze-film damping and nonlinear electrostatic forces.

Film acoustically-coupled transformer modulates signals through mechanical vibrations to achieve high-speed data transmission exceeding 100 Mb/s.

Deformable U-shaped brackets in this noise absorbing apparatus accommodate varying cable diameters while maintaining holding strength.

Lower-scandium protective film prevents excessive dissolution of high-scandium piezoelectric films during hydrofluoric acid etching.

Tapered viaholes in a cap wafer enable compact SAW device packaging, reducing manufacturing complexity while maintaining hermetic sealing.

Metal pillars and protection rings create protective cavities in a chip stack, resolving structural strength issues from packaging material contact.

Penetrating insulation portions anchor into external connection conductors, suppressing peeling forces and improving reliability.

Controlling the Al joining layer thickness to 2000 nm or less suppresses Kirkendall voids during thermal shock, maintaining high bonding strength.

Electromechanical frequency selective surfaces reject neighboring interference without retrofitting existing receiver systems.

A heat dissipating film with recessed side surfaces prevents contact between the thermal management layer and adjacent components in elastic wave devices.

Local quality resin shapes seal facing spaces without increasing device size, preventing component deformation from thermal expansion.

Replacing gold with copper or aluminum in through holes reduces manufacturing costs and prevents CMOS contamination while maintaining connection reliability.

Sacrificial layer removal creates suspended piezoelectric structures, resolving thickness homogeneity issues in FBAR fabrication.

Argon concentration gradients in the amorphous transition layer increase bonding strength while preventing thermal warping during heat treatment.

Removing insulating films between the first electrode and aluminum nitride layer enables efficient C-axis orientation and strong electric field application.

Depositing and annealing metallic layers on resonant micromechanical elements to tune resonant frequencies via stress state alteration.

A guided acoustic wave device uses a slow wave propagation overlay with varying width to adjust wave velocity and maintain piston mode.

A resonator element connects to a heat generation portion on a base substrate with a protruding portion for mechanical support.

Offsetting electrode and support center lines from vibration region centers minimizes energy loss caused by adjacent region interference.