Resonator Element Stability via Protruding Portion and Heat Generation
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Solution Overview
Problem
Resonation devices with piezoelectric resonance elements connected directly to integrated circuit chips face issues with mechanical stability and impact resistance due to one-point support and exposure to external impacts, leading to potential breakdown and unstable temperature maintenance.
Innovation Solution
A resonation device design featuring a base substrate with a protruding portion and a heat generation element positioned to provide a larger connection area between the resonator element and the heat generation element, with the resonator element's centroid between the connection and protruding portions, and additional protruding portions on either side of the virtual line through the connection, to enhance stability and heat retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the resonator element is one-sidedly connected onto the integrated circuit chip including the heating unit, then the resonator element can be heated efficiently, but the resonator element becomes free and is prone to bending and breakdown under impact
Solution Approach 1:
The base substrate is segmented into multiple functional regions: a heating region with the heating unit, a support region with the protruding portion, and a connection region. This spatial segmentation allows the resonator element to be simultaneously heated efficiently while being mechanically supported and constrained, resolving the contradiction between heating efficiency and impact resistance.
Solution Approach 2:
The protruding portion acts as an intermediary element between the base substrate and the resonator element. It provides mechanical support and constraint to the resonator element without interfering with the heating process, thus mediating between the thermal function and mechanical stability requirements.
2Device complexity
If the resonator element is one-sidedly connected onto the integrated circuit chip, then the connection is simplified, but the connection posture becomes unstable and difficult to maintain
Solution Approach 1:
The base substrate is designed with different local qualities in different regions: the heating region provides thermal energy, the protruding portion provides mechanical support and positional constraint, and the connection region enables electrical and thermal coupling. This local differentiation allows simple one-sided connection while achieving stable connection posture through the strategically positioned protruding portion.
3Temperature
If the connection area between the resonator element and heat generation portion is increased, then heat transfer is improved, but the device structure becomes more complex
Solution Approach 1:
The base substrate serves multiple functions simultaneously: it provides mechanical support, thermal management through the heating unit, positional constraint via the protruding portion, and electrical connection. By making the base substrate multi-functional, the patent achieves improved temperature maintenance through larger effective heat transfer area without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the resonator element's posture, improves impact resistance, and maintains a consistent temperature by increasing the heat transfer area and reducing heat loss, resulting in enhanced performance and reliability.
Implementation Method 1
a piezoelectric resonance element (resonator element) which is one-sidedly connected onto an integrated circuit chip including a heating unit (heat generation portion) is sealed within a vacuum chamber (package storage space). In this manner, the piezoelectric resonance element (resonator element) is connected directly onto the integrated circuit chip including the heating unit (heat generation portion), thereby allowing the piezoelectric resonance element (resonator element) to be heated efficiently.
Data Source
AI summary
A resonation device includes a heat generation element as a heat generation portion which is disposed on a bottom plate of a package as a base substrate, a resonator element having connection portions and fixed to the heat generation element, and a protruding portion which overlaps a region different from the connection portions and of the resonator element when seen in plan view and is provided on the bottom plate. The area of the connection portions is larger than the area of the protruding portion when seen in plan view.