Vibrating Element Mass Adjustment Positioning for Laser Frequency Tuning
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Solution Overview
Problem
In vibrating devices that use a laser beam to adjust the vibration frequency of a gyro element, the beam can damage the semiconductor substrate due to transmission through the vibrating element.
Innovation Solution
The mass adjustment part is positioned such that it does not overlap with the circuit element in a plan view, preventing direct laser beam application to the semiconductor substrate, and a protective layer or metal layer removal is used to prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a laser beam is used to adjust the vibration frequency of the vibrating element, then the vibration frequency can be precisely adjusted, but the laser beam can damage the semiconductor substrate (circuit element)
Solution Approach 1:
The patent positions the mass adjustment part in a specific location on the vibrating element such that in the plan view (XY plane), the mass adjustment part does not overlap with the circuit element. This spatial arrangement in another dimension (planar positioning) allows the laser beam to remove mass from the vibrating element without transmitting damage to the underlying circuit element on the semiconductor substrate.
2Reliability
If the mass adjustment part is positioned to prevent laser beam damage, then the circuit element is protected, but the adjustment process becomes more complex
Solution Approach 1:
The patent separates the function of mass adjustment from the circuit element area by positioning the mass adjustment part on the vibrating element in a location that does not overlap with the circuit element in plan view. This segmentation of spatial functions allows independent optimization: the mass adjustment part can be accessed by the laser beam while the circuit element remains protected, reducing the need for additional protective measures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents damage to the circuit element and allows for reliable frequency adjustment without harming the semiconductor substrate, ensuring stable and reliable electronic devices and apparatus.
Implementation Method 1
a laser beam is used for removing at least a part of a mass adjustment part (an electrode or the like) provided on the vibrating element
Data Source
AI summary
A vibrating element as an element on which a base part, a supporting part extending from the base part, and adjustment electrodes as mass adjustment parts are provided and a semiconductor substrate as a circuit element are provided, and the adjustment electrodes are placed in locations not overlapping with the semiconductor substrate in a plan view, the supporting part and the semiconductor substrate are connected, and thereby, the vibrating element is mounted on the semiconductor substrate.