Recessed Resin Sealing for Electronic Component Thermal Stress
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Solution Overview
Problem
The existing electronic devices face issues with sealing performance, leading to functional drops in electronic components due to thermal expansion and increased size when thicker sealing materials are used, and these materials can deform the components.
Innovation Solution
An electronic device configuration featuring a circuit board with an electronic component mounted on its surface, where a recessed resin seals the facing space between the component and the board, reducing the likelihood of peeling and maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing material is made thicker to improve sealing performance, then the sealing performance is improved, but the size of the electronic device increases
Solution Approach 1:
The resin is configured with different shapes in different regions: in the first region it has a first shape, and in the second region it has a second shape that is different from the first shape. This local differentiation allows the resin to provide enhanced sealing performance in specific areas without uniformly increasing the overall thickness and size of the electronic device.
2Reliability
If the sealing material is made thicker to improve sealing performance, then the sealing performance is improved, but the deformation of the electronic component increases due to thermal expansion
Solution Approach 1:
The resin is configured with different shapes in different regions: in the first region it has a first shape, and in the second region it has a second shape that is different from the first shape. This local differentiation allows the resin to provide enhanced sealing performance in specific areas without uniformly increasing the overall thickness and size of the electronic device.
3Reliability
If a bulging sealing material is used to seal the facing space, then the sealing performance is improved, but the peeling of the sealing material occurs
Solution Approach 1:
The resin is configured with different shapes in different regions: in the first region it has a first shape, and in the second region it has a second shape that is different from the first shape. This local differentiation allows the resin to provide enhanced sealing performance in specific areas without uniformly increasing the overall thickness and size of the electronic device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively seals the electronic component, reducing the risk of peeling and deformation caused by thermal expansion, while allowing for higher air pressure in the facing space, thus enhancing the device's operational stability and reliability.
Implementation Method 1
a resin which is adhered to side surfaces of the electronic component and to the wiring board and seals a facing space between the front surface of the wiring board and the major surface of the electronic component
Implementation Method 2
the sealing material exerts an influence upon a deformation of the electronic component due to a thermal expansion or the like
Data Source
AI summary
The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.