Integrated Filter Package with On-Chip Impedance Matching
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Solution Overview
Problem
Conventional filters for high-frequency wireless communications devices face limitations due to external impedance matching circuits, which introduce discontinuity and parasitic losses, reducing their effectiveness and requiring reduced or omitted matching circuits, thereby compromising performance.
Innovation Solution
The integration of internal impedance matching circuits within the filter package, connected to an internal ground structure, eliminates the need for external matching components, minimizing resistive losses and enhancing performance by providing higher quality impedance matching and reducing the footprint of the filter package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external impedance matching circuits are used, then filter performance can be improved, but resistive losses and parasitic effects increase at high frequencies
Solution Approach 1:
The patent combines the impedance matching circuits with the filter device by integrating them into a single package. The matching circuits are formed on a substrate within the package, electrically connected to the filter device terminals, eliminating the need for external matching circuits and their associated connecting structures that cause resistive losses.
Solution Approach 2:
The patent introduces an intermediary substrate structure that hosts the impedance matching circuits within the package. This substrate acts as a mediator between the filter device and the package terminals, providing integrated matching functionality without requiring external connecting structures that introduce parasitic effects.
2Reliability
If external impedance matching circuits are used, then impedance matching can be achieved, but the footprint and complexity of the filter package increase
Solution Approach 1:
The patent merges the impedance matching functionality with the filter device by integrating the matching circuits onto the same substrate within the package. This consolidation reduces the overall device complexity and footprint compared to using separate external matching circuits.
Solution Approach 2:
The substrate within the package serves multiple functions: it supports the filter device, hosts the impedance matching circuits, and provides electrical interconnections. This multi-functionality reduces the need for separate components and simplifies the overall package structure.
3Reliability
If external impedance matching circuits are used, then filter performance can be optimized, but manufacturing yield and test repeatability decrease
Solution Approach 1:
The patent combines the filter device and impedance matching circuits into a single integrated package, eliminating the need for separate external matching circuits. This integration improves manufacturing yield and test repeatability by reducing the number of discrete components and interconnections that require assembly and testing.
Data Source
AI summary
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.