Radial Signal Line Substrate for High Frequency Device Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High frequency device mounting substrates face challenges in achieving reliable connections with coaxial connectors, leading to degraded performance due to increased heat resistance issues and reduced heat capacity, which affects the measurement and evaluation of high frequency devices, especially in miniaturized devices like piezoelectric filters and duplexers.
Innovation Solution
The substrate design features signal lines radially extending from terminal electrodes with ground conductor layers on both sides, a gap between signal lines and ground conductors, and through conductors connecting the ground layers, reducing electromagnetic interference and parasitic inductance, and allowing for efficient soldering and removal of coaxial connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate size is reduced to accommodate miniaturized high frequency devices, then the heat capacity is reduced and heat resistance deteriorates, but the device size must be smaller
Solution Approach 1:
The substrate is divided into multiple insulator layers with conductor layers embedded within, creating a multi-layer structure that distributes heat pathways and improves heat dissipation efficiency while maintaining a compact overall size
Solution Approach 2:
The invention transitions from a planar two-dimensional layout to a three-dimensional multi-layer structure by stacking insulator and conductor layers vertically, enabling better heat management through additional thermal pathways without increasing the horizontal footprint
2Device complexity
If conventional signal line layouts are used, then the device structure is simple, but electromagnetic interference increases and measurement accuracy deteriorates
Solution Approach 1:
Signal lines are configured with asymmetric routing patterns where adjacent signal lines do not follow parallel or symmetric paths, reducing electromagnetic coupling and interference between lines while maintaining manageable structural complexity
Solution Approach 2:
Signal lines are designed with curved trajectories rather than straight linear paths, allowing them to naturally diverge and reduce parallel run lengths, thereby minimizing electromagnetic interference while keeping the layout organized
3Reliability
If ground conductor layers are placed close to signal lines, then the parasitic inductance is reduced, but electromagnetic interference between adjacent signal lines increases
Solution Approach 1:
Ground conductor layers are positioned at different distances from different signal lines based on local requirements - closer to signal lines where low inductance is critical and farther where interference reduction is prioritized, optimizing both parameters locally across the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances out-of-band attenuation and isolation characteristics, improves measurement accuracy, and enables faster and more reliable mounting and removal of high frequency devices, maintaining superior performance even in miniaturized forms.
Implementation Method 1
providing a through hole penetrating the insulator layers in the circuit board and also providing a conductor layer on an inner surface of the through hole to electrically connect the ground conductor layers to one another, to reduce the parasitic inductance of the ground electrode
Implementation Method 2
the signal lines respectively radially extending from the terminal electrodes, a straight line that is a virtual extension of the one arbitrary signal line from the terminal electrode and a straight line that is a virtual extension of the other one arbitrary signal line from the terminal electrode not constituting a same straight line
Data Source
AI summary
Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.