Electronic Component Uneven Structure Creeping Discharge
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Solution Overview
Problem
In electronic components, creeping discharge between high-voltage and low-voltage electrodes can lead to insulation deterioration and short circuits, reducing the component's withstand voltage.
Innovation Solution
An uneven structure is formed between the high-voltage and low-voltage electrodes on the insulating layer, increasing the creeping distance and preventing discharge, thereby enhancing the component's withstand voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between high-voltage electrode and low-voltage electrode is reduced, then the device size is reduced, but creeping discharge occurs more easily between the electrodes
Solution Approach 1:
The patent introduces a third dimension (vertical height) to the insulating layer to solve the two-dimensional problem of electrode spacing. By increasing the height of the insulating layer between electrodes, the creeping distance is extended without increasing the planar footprint of the device, thus maintaining compact size while improving insulation performance and preventing creeping discharge.
2Reliability
If a thick insulating layer is used between high-voltage and low-voltage electrodes, then creeping discharge is suppressed, but the device size increases
Solution Approach 1:
The patent utilizes the vertical dimension (height) of the insulating layer to increase the creeping distance between electrodes. This allows the device to achieve improved insulation performance and suppressed creeping discharge without increasing the horizontal dimensions, thus avoiding an overall increase in device size.
3Reliability
If the insulating distance between electrodes is increased, then withstand voltage is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent changes the geometric parameters of the insulating layer, specifically increasing its height, to improve withstand voltage and suppress creeping discharge. This parameter modification is achieved through standard manufacturing processes without significantly increasing manufacturing complexity.
Data Source
AI summary
An electronic component includes a first insulating layer, a high-voltage electrode formed on the first insulating layer, a low-voltage electrode formed on the first insulating layer so as to be spaced from the high-voltage electrode, and an uneven structure formed in a region between the high-voltage electrode and the low-voltage electrode along a surface of the first insulating layer.