Electronic Device Electrical Connection Pad Manufacturing
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Solution Overview
Problem
Conventional semiconductor thin-film processes produce conductive lines that are too thin to directly connect electronic elements to circuit substrates, necessitating a solution for electrical connection.
Innovation Solution
An electronic device and manufacturing method involving a thin-film conductive line and an electrical connection pad formed on a substrate, where the pad is printed to connect with the conductive line, allowing electronic elements to be electrically connected via the pad, using materials like copper powder and polymer, and potentially with an insulation layer, to achieve thickness and porosity suitable for reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If general semiconductor thin-film process is used to manufacture conductive lines, then manufacturing precision and fine line capability are improved, but the conductive line thickness becomes too thin (less than 3 μm) to directly connect electronic elements
Solution Approach 1:
The patent introduces an electrical connection pad as an intermediary component between the thin-film conductive line and the electronic element. The pad serves as a mediator that bridges the thickness gap, allowing the thin conductive line to be connected to thicker electronic element leads through a intermediate structure that provides sufficient mechanical and electrical reliability.
Solution Approach 2:
The electrical connection pad is constructed using composite materials, specifically copper powder embedded in a polymer matrix. This composite structure combines the high electrical conductivity of copper powder with the mechanical strength and formability of polymer materials, creating a pad that is both electrically conductive and mechanically robust enough to support electronic element connections.
2Reliability
If conventional thick conductive lines (greater than 3 μm) are used for electrical connection, then connection reliability is improved, but manufacturing precision and fine line capability deteriorate
Solution Approach 1:
The patent divides the electrical connection structure into two separate segments: a thin-film conductive line for signal/power transmission and an electrical connection pad for mechanical/electrical interface. This segmentation allows each component to be optimized independently - the conductive line can be manufactured with high precision and fine line dimensions, while the pad can be designed with sufficient thickness and strength for reliable connections.
Solution Approach 2:
The patent applies local quality by giving different thickness characteristics to different parts of the conductive structure. The conductive line portion maintains thin dimensions for precision manufacturing and signal integrity, while the electrical connection pad portion has increased thickness for mechanical strength and connection reliability. This localized variation in thickness optimizes both manufacturing precision and connection reliability.
3Reliability
If electrical connection pad with sufficient thickness (3-20 μm) is introduced to bridge the connection, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection pad with the existing thin-film conductive line structure, forming an integrated conductive pattern. The pad is not a separate discrete component but is instead formed as part of the same conductive layer system, using the same deposition and patterning processes. This merging approach adds the necessary connection functionality without significantly increasing overall device complexity.
Solution Approach 2:
The electrical connection pad is formed using the same thin-film manufacturing processes that create the conductive lines, allowing the pad to be self-formed during the existing fabrication sequence. The pad material and structure are deposited and patterned along with the conductive lines, eliminating the need for separate manufacturing steps or additional processing equipment, thereby minimizing the increase in device complexity.
Data Source
AI summary
An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.