Printed Circuit Assembling TRIZ Cases

Parallel processing of metal layer carriers with conductive paste filling eliminates sequential plating to reduce stress and manufacturing time.

Photopolymerizable resin layer fixes conductive particles via ultraviolet irradiation to secure single-layer positioning.

An integral nickel weld plate absorbs resistance spot welding heat, preventing irreversible thermal damage to the PPTC material during strap attachment.

Integrating the touch control panel with embedded bonding pads reduces flexible printed circuit connections.

Removing power connector locations from the interconnection array eliminates obstructing vias, reducing required signal routing layers.

Segmented magnetic regions with varying permeability enclose individual coils to reduce mutual inductance and increase leakage inductance.

Flux containing metal powder enhances wetting and contact between molten lead-free solder and electrodes, preventing insulation degradation without washing.

Embedding a heat slug inside the substrate reduces junction temperature and manufacturing costs by linking thermal paths to metal layers.

A cutting jig uses a heated blade to sever bonding material between a slider and flexure while a holding mechanism constrains the slider position.

A laser beam joins a thick copper strip to a thermally sprayed conductive layer for high-current connections.

A parylene coating protects electric drive circuit boards from moisture and chemical exposure while maintaining press-fit contact integrity.

Polished insulating surfaces and tapered through-wirings overcome laser processing limits to achieve higher wiring density.

An LED control circuit terminates bias current to a dummy load when detecting active LED current.