Flexible Touch Screen FPC Bonding Simplification
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Solution Overview
Problem
Conventional flexible touch screens have a complex and labor-intensive bonding process for flexible circuit boards, requiring multiple FPC connections, which complicates integration and increases material usage.
Innovation Solution
A flexible touch screen design where the touch-control flexible circuit board is integrated into the touch control panel, allowing direct bonding to the flexible substrate's outer lead bonding area, simplifying the bonding process and reducing the number of FPC connections by embedding bonding pads within the touch control panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conventional bonding process is used to bond the touch flexible circuit board to the touch control panel and then to the main flexible circuit board, then the flexible touch screen can be assembled, but the bonding process becomes complicated and requires a large number of FPC
Solution Approach 1:
The patent merges the touch-control flexible circuit board with the touch control panel by embedding the circuit board directly into the panel structure. This integration eliminates the need for separate bonding steps between the touch flexible circuit board and the touch control panel, thereby simplifying the overall bonding process and reducing the number of FPC connections required
Solution Approach 2:
The touch control panel is designed to serve multiple functions: it acts as both the display control panel and the mounting structure for the touch flexible circuit board. The embedding structure allows the panel to simultaneously provide structural support, electrical connection, and circuit board mounting, reducing the need for separate components
2Device complexity
If the touch-control flexible circuit board is integrated into the touch control panel, then the number of FPC connections is reduced, but the integration property must be enhanced to maintain reliability
Solution Approach 1:
The touch-control flexible circuit board is embedded within the touch control panel structure, creating a nested configuration where the circuit board is housed inside the panel's structural framework. This nesting approach maintains strong mechanical bonding and electrical connections while reducing the overall number of external FPC connections required
Solution Approach 2:
The bonding pads are pre-configured on the flexible substrate in specific areas (main outer lead bonding area and touch lead bonding area) before the embedding process. This preliminary preparation ensures that when the touch-control flexible circuit board is embedded, reliable electrical connections are established without requiring additional bonding steps, thereby maintaining reliability while simplifying the final assembly
Data Source
AI summary
A flexible touch screen includes a flexible substrate having a main outer lead bonding area and a touch lead bonding area provided with flexible-printed-circuit-board bonding pads; and a touch control panel connected to the flexible substrate via an adhesive layer. The touch control panel has a surface facing the flexible substrate and having a touch-control flexible circuit board mounted thereon. The touch-control flexible circuit board corresponds to the touch lead bonding area in position. In bonding of flexible circuit boards, the touch-control flexible circuit board of the touch control panel is bonded to the flexible-printed-circuit-board bonding pads in the touch lead bonding area; the flexible substrate is bonded to a main flexible circuit board via the flexible-printed-circuit-board bonding pads in the main outer lead bonding area. The FPC bonding process for the flexible touch screen is simplified, and the number of FPC is reduced.