Electronic Device Sealing with Inorganic Insulating Layer
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Solution Overview
Problem
Conventional electronic devices face issues with resin material invasion into the space surrounding chip components, leading to deterioration of electronic element characteristics.
Innovation Solution
An electronic device configuration that includes a chip component mounted on a wiring board with a space for the electronic element, surrounded by a resin layer and an inorganic insulating layer positioned at the sides of the resin layer, reducing water vapor invasion and enhancing airtight sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin layer is provided from the surface of the chip component to the surface of the wiring board to surround the space, then sealing performance is improved, but resin material invades the space and adheres to the electronic element causing characteristic deterioration
Solution Approach 1:
The sealing structure is divided into two distinct layers: a resin layer for primary sealing and an inorganic insulating layer positioned at the side of the space to prevent resin invasion. This segmentation allows each layer to perform its specific function without interfering with the other, solving the contradiction between sealing performance and resin invasion prevention.
Solution Approach 2:
The inorganic insulating layer acts as an intermediary barrier between the resin layer and the space containing the electronic element. It prevents direct contact and potential invasion of the resin material into the space, while still allowing the resin layer to provide effective sealing.
2Reliability
If the resin layer completely surrounds the space, then sealing performance is improved, but the resin material adheres to the electronic element and causes characteristic deterioration
Solution Approach 1:
The sealing function is segmented between the resin layer (providing airtight sealing) and the inorganic insulating layer (preventing resin adhesion to electronic elements). This allows complete surrounding of the space for sealing while preventing harmful adhesion through the intermediate inorganic layer.
Solution Approach 2:
The inorganic insulating layer serves as a protective intermediary that prevents the resin material from adhering to the electronic element, thereby maintaining the electronic characteristics while still allowing the resin layer to completely surround the space for optimal sealing.
Data Source
AI summary
An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device (1) is provided with: a chip component (2) having an electronic element (22); a wiring board (3) on which the chip component (2) is mounted with a space therebetween, the space for containing the electronic element (22); a resin layer (4) provided from the surface of the chip component (2) to the surface of the wiring board (3) so as to surround the space; and an inorganic insulating layer (5), which is provided at the resin layer (4) and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer (4) but also by means of the inorganic insulating layer (5), the electronic device (1) having high airtight sealing performance can be provided.