Electronic Device Wiring Distribution for Bonding Stability
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Solution Overview
Problem
Existing electronic devices with MEMS-based sensors face issues with airtightness deterioration due to unstable bonding states caused by multiple wirings being drawn from a single side, leading to uneven bonding strength and potential leaks.
Innovation Solution
The electronic device design incorporates multiple wiring portions extending through different bonding regions, distributing the wiring connections to increase the bonding area and maintain a balanced bonding strength, even with increased numbers of wirings, by using a partitioned accommodation space and sealing members to ensure airtightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple wirings are drawn from a single side through one bonding region, then the wiring connections can be established, but the bonding state becomes unstable and airtightness deteriorates due to uneven bonding strength
Solution Approach 1:
The bonding region is divided into multiple separate bonding regions (first bonding region, second bonding region, third bonding region) distributed around the accommodation space. Wirings are drawn through different bonding regions rather than concentrating all wirings in one location, which distributes the bonding load and prevents localized stress concentration that would compromise airtightness.
Solution Approach 2:
Different bonding regions are positioned at different locations around the accommodation space to optimize local bonding conditions. Each bonding region can be optimized for its specific location, allowing wirings to be extracted through multiple distributed points rather than a single point, thereby maintaining uniform bonding strength across the entire bonding interface.
2Ease of manufacture
If wirings are extracted through the bonding portion, then electrical connections are achieved, but gaps are created where the accommodation space communicates with the outside, requiring additional sealing measures
Solution Approach 1:
The wiring extraction path is segmented across multiple bonding regions rather than concentrating all extractions through one bonding portion. This distribution reduces the cumulative gap area created by multiple wirings, minimizing the total communication path between the accommodation space and outside environment.
Solution Approach 2:
The bonding portions themselves serve as intermediary sealing structures that simultaneously provide both wiring extraction pathways and airtight sealing. By designing the bonding regions to inherently seal around the wirings, the patent eliminates the need for separate gap-filling adhesive layers while maintaining both electrical connectivity and airtightness.
Data Source
AI summary
An electronic device includes an accommodation space formed between a first base material and a second base material so as to seal a space therebetween, and a functional element in the accommodation space. The accommodation space is formed in an inner region of a bonding portion between the first base material and the second base material. The electronic device includes wirings extending from the inner region through the bonding portion to the outside of the accommodation space. The bonding portion includes a first bonding region and a second bonding region. The wiring includes a first wiring portion having a first direction toward the outside through the first bonding region from the inner region and a second wiring portion having a second direction toward the outside through the second bonding region from the inner region. The first and the second directions are different.