Electronic Module Cover with Integrated Thermal Support
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Solution Overview
Problem
Existing electronic modules struggle to efficiently evacuate increasing heat generated by high power density electronic components, particularly in on-board aviation assemblies, where conventional designs fail to effectively dissipate heat due to rising power dissipation demands.
Innovation Solution
The electronic module features a substantially planar card with two covers, where one cover has a central part with flanged edges extending into flat supports parallel to the card, allowing for enhanced heat drainage to cold zones such as slide zones, and incorporates indexing means for improved assembly and positioning, along with a heat sink for additional thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional designs are used with screws to fix covers to the electronic card, then the assembly structure is simple, but the heat evacuation capability is insufficient due to rising power dissipation demands
Solution Approach 1:
The support structure and heat dissipation function are merged into a single integrated component. The flat support extends from the cover and provides both mechanical attachment for the electronic card and thermal conduction path for heat evacuation, eliminating the need for separate heat sink components in some configurations.
Solution Approach 2:
The flat support serves multiple functions simultaneously: it provides mechanical support and positioning for the electronic card, acts as a thermal conduction path for heat evacuation, and enables cooperation with slide zones for mounting in connection boxes. This multi-functionality addresses both structural and thermal requirements.
2Productivity
If the electronic card is held between two covers fixed by screws, then the assembly is secure, but the assembly time is long and productivity is reduced
Solution Approach 1:
The screw fastening operation is extracted and eliminated from the assembly process. The press-fit mechanism between the flat support and the electronic card allows for rapid assembly without requiring threading or tightening operations, significantly reducing assembly time while maintaining secure fixation.
Solution Approach 2:
The flat support and electronic card are designed with complementary geometric features that enable self-alignment and self-positioning during assembly. The indexing means on the cover and corresponding features on the card work together to automatically position components correctly when the cover is pressed onto the card, eliminating the need for manual alignment.
3Manufacturing precision
If indexing means are added to improve positioning during assembly, then assembly precision is improved, but device complexity increases
Solution Approach 1:
The indexing means are integrated directly into the cover structure as geometric features rather than separate components. The indexing protrusions and corresponding recesses are formed as part of the cover and card manufacturing, eliminating the need for separate positioning elements while providing precise alignment functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration facilitates faster assembly and significantly enhances heat dissipation by directing heat towards cold zones, improving thermal management and reducing the risk of component damage from shocks during handling.
Implementation Method 1
the electronic card being attached to said support of the first cover... makes it possible to drain the calories towards the support of the cowl(s), and subsequently to direct the heat to be evacuated from the thermal components towards cold zones
Implementation Method 2
the first cover has on its face opposite the electronic card a heat sink integral with the first cover
Implementation Method 3
the heat generated by the electronic components is evacuated to the open air via the covers
Data Source
AI summary
The invention relates to an electronic module (2) comprising: - an electronic board (4) on which electronic components (10) are arranged, - two covers (6, 8), arranged on either side of the board (4). The cover (6) facing the components (10) has a central portion (22) extending away from the board (4) and a dropped edge (24) oriented towards the board (4) extending from one of the two opposite sides of the central portion (22). This dropped edge (24) is extended by a flat support (26), extending in a plane parallel to the plane of the electronic board (4), the board (4) being mounted on said support (26). The covers (6, 8) have indexing means (34), the electronic board (4) having indexing holes (36) cooperating with the indexing means (34) when the board (4) is positioned between the covers (6, 8).