Electronic Module Connecting Terminal Design

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Solution Overview

Problem

Electronic modules with long wiring distances experience increased resistance and impedance, leading to noise-related issues due to the conventional connection methods.

Innovation Solution

The electronic module design incorporates connecting terminals with extending parts on both sides of the substrate, allowing electronic components to be connected without the need for through-holes, thereby reducing the distance between components and preventing noise-related problems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If terminals extend to one side only for connection with external devices, then the connection structure is simple, but wiring distance becomes long causing increased resistance and impedance

Engineering Contradiction:

Improveconnection structureVSAvoidresistance and impedance

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The connecting terminal extends in multiple directions (both upward and downward from the substrate) rather than only in one direction, utilizing three-dimensional space to reduce wiring distance while maintaining connection functionality. This dimensional change allows the terminal to connect components on opposite sides of the substrate without requiring long lateral wiring paths.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If connecting terminals with extending parts on both sides are used, then wiring distance is reduced and resistance/impedance decrease, but the terminal structure becomes more complex

Engineering Contradiction:

Improveresistance and impedanceVSAvoidterminal structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The connecting terminal integrates multiple functions into a single structure: it provides electrical connection, mechanical support, and shortened wiring path simultaneously. By merging the connection function and support function into one integrated terminal structure, the patent reduces the need for separate components, thereby offsetting the increased terminal complexity with overall system simplification.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If through-holes are used for connecting components on both sides of substrate, then electrical connection is achieved, but manufacturing process becomes complicated

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Instead of creating holes through the substrate to achieve connection (conventional approach), the patent inverts the approach by extending terminals from the substrate surface in both directions. This inversion eliminates the need for through-hole drilling, plating, and filling processes, significantly simplifying the manufacturing process while maintaining reliable electrical connection.

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentUS10510636B2Electronic module

Publication Date: 2019.12.17 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

An electronic module comprises a substrate 11, 21, an other-side electronic component 18, 23 provided on the other side of the substrate 11, 21, a one-side electronic component 13, 28 provided on one side of the substrate 11, 21 and a connecting terminal 115, 125 having an other-side extending part 119a, 129a extending to circumferential outside of the substrate 11, 21 on the other side of the substrate 11, 21, a one-side extending part 119b, 129b extending to circumferential outside of the substrate 11, 21 on one side of the substrate 11, 21, and a connecting part 118, 128 connecting the other-side extending part 119a, 129a with the one-side extending part 119b, 129b at the circumferential outside of the substrate 11, 21.