Electronic Package Coil Structure With Ferrite for Higher Inductance
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Solution Overview
Problem
Conventional semiconductor packages face issues with insufficient inductance due to coil-type inductors disposed on the package substrate, resulting in inductance values that are too small to meet performance requirements.
Innovation Solution
The electronic package design incorporates a carrier structure with supporting members and a magnetically permeable member, surrounded by conductive members forming a coil, utilizing conductive through vias and a ferrite material to enhance magnetic flux and increase inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a coil-type inductor is disposed on the package substrate, then the package structure is simple, but the inductance value is too small (about 17 nH) to meet requirements
Solution Approach 1:
The patent changes the physical parameters of the inductor by introducing a magnetically permeable member (ferrite) with high magnetic permeability. This material parameter change concentrates magnetic flux and increases the inductance value from 17 nH to greater than 75 nH, resolving the contradiction between structural simplicity and sufficient inductance.
Solution Approach 2:
The patent uses a composite structure combining the coil-type inductor with a magnetically permeable member (ferrite material). This composite design leverages the magnetic properties of ferrite to enhance the inductance value while maintaining the compact package structure, effectively resolving the contradiction between simplicity and performance.
2Reliability
If the inductance is increased by adding more coil turns or larger coil area, then the inductance value increases, but the package volume increases
Solution Approach 1:
Instead of increasing coil geometry (turns or area) to increase inductance, the patent changes the magnetic material parameter by introducing ferrite with high magnetic permeability. This allows achieving inductance greater than 75 nH without increasing the physical dimensions of the package, resolving the contradiction between inductance value and package volume.
Solution Approach 2:
The patent replaces the mechanical/geometric approach (increasing coil size or turns) with a material-based approach (using magnetically permeable ferrite). This substitution achieves the desired inductance increase through magnetic flux concentration rather than physical expansion, resolving the volume-inductance contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively improves inductance to values greater than 75 nH, addressing the issue of too small inductance without increasing package volume, by concentrating magnetic fields on a ferromagnetic path with a magnetically permeable member.
Implementation Method 1
The magnetically permeable member is ferrite... concentrating magnetic fields on a ferromagnetic path with a magnetically permeable member... the inductance generated by the coil-type inductor 12 is too small (about 17 nanohenries [nH]) and thus does not meet the requirements
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which a magnetically permeable member and a plurality of supporting members having conductive through vias are disposed on a carrier structure having a circuit layer, the magnetically permeable member is located between two supporting members, and a conductive member is disposed on the supporting members to cover the magnetically permeable member, so that the circuit layer, the conductive through vias and the conductive member form a coil surrounding the magnetically permeable member to increase the inductance.