Electronic Package Conductive Pillar Layout for Stress-Tolerant Bonding
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Solution Overview
Problem
Conventional flip chip semiconductor packaging experiences issues with conductive pillars having a low aspect ratio, leading to stress concentration and breakage, resulting in poor electrical conductivity due to disconnection of conductive elements from electrode pads.
Innovation Solution
The electronic structure incorporates conductive pillars with increased aspect ratios and multiple electrical connection paths, allowing stable disposition of conductive elements and stress dispersion, enhancing reliability and conductivity by using conductive pillars to distribute stress during extrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the aspect ratio of conductive pillars is increased, then the stability and stress distribution improve, but the manufacturing complexity and electroplating difficulty increase
Solution Approach 1:
The conductive connection path is segmented into multiple conductive pillars arranged in parallel between the conductive element and electrode pad, rather than using a single long pillar. This segmentation distributes the mechanical stress across multiple shorter pillars, improving reliability while keeping each individual pillar's aspect ratio manageable for manufacturing
Solution Approach 2:
Multiple conductive pillars are nested within the insulating layer, with their top surfaces exposed through openings. The pillars are positioned in a nested arrangement where they collectively support the conductive element above them, creating a stable connection structure without requiring excessive vertical space
2Reliability
If multiple conductive pillars are used to distribute stress, then the electrical conductivity and reliability improve, but the manufacturing precision requirements increase
Solution Approach 1:
The insulating layer is designed with localized openings at specific positions where conductive pillars need to be formed. This local modification approach allows precise positioning of conductive pillars only where needed, while the rest of the insulating layer remains intact to provide mechanical support and electrical isolation, thereby reducing overall manufacturing precision requirements
Solution Approach 2:
The insulating layer with pre-formed openings is created before depositing the conductive pillars. This preliminary action establishes the exact positions where conductive pillars will be formed, guiding the subsequent electroplating process and ensuring accurate positioning without requiring high precision during the pillar formation step itself
Data Source
AI summary
An electronic package is provided in which an electronic structure is bonded onto a carrier structure via a plurality of conductive elements, where each of the conductive elements is connected to a single contact of the electronic structure via a plurality of conductive pillars. Therefore, when one of the conductive pillars fails, each of the conductive elements can still be electrically connected to the contact via the other of the conductive pillars to increase electrical conductivity.