Electronic Package Lamination for Thermal Stress Delamination Control
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Solution Overview
Problem
Conventional semiconductor packages face issues of delamination and structural cracking due to uneven thermal stress caused by mismatched heights of package modules and semiconductor chips, leading to potential breakage of the carrier structure and cracking of functional chips.
Innovation Solution
The introduction of a laminating member, which can be a glass or mesh structure, bonded to the semiconductor chip and package module via a heat dissipating layer, and a heat dissipating member with a supporting leg, distributes thermal stress evenly and increases structural rigidity, preventing delamination and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If package module and semiconductor chip are disposed on carrier structure with different heights, then functional integration is achieved, but thermal stress becomes uneven causing delamination
Solution Approach 1:
A stress compensation layer is introduced between the semiconductor chip and the carrier structure. This intermediary layer has different elastic moduli on its upper and lower surfaces, allowing it to compensate for the height difference between the package module and semiconductor chip, thereby equalizing thermal stress distribution and preventing delamination while maintaining functional integration.
2Temperature
If heat dissipating member is laminated directly to components of different heights, then heat dissipation is achieved, but pressure inconsistency causes carrier structure breakage
Solution Approach 1:
The stress compensation layer serves as an intermediary between the heat dissipating member and the components below. It provides a uniform bonding surface that distributes pressure evenly across the carrier structure, preventing breakage while allowing effective heat dissipation to occur through the heat dissipating member.
3Adaptability or versatility
If package module height exceeds semiconductor chip height, then optical integration is enabled, but uneven pressure distribution causes functional chip cracking
Solution Approach 1:
The stress compensation layer acts as a mediator that equalizes pressure distribution from the heat dissipating member across both the package module and semiconductor chip. By having different elastic moduli on its upper and lower surfaces, it compensates for the height difference, enabling optical integration while preventing functional chip cracking through uniform stress distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminating member effectively disperses thermal stress, ensuring even pressure distribution and preventing structural breakage and chip cracking, thereby enhancing the reliability and integrity of the semiconductor package.
Implementation Method 1
a laminating member disposed on the semiconductor chip and the package module; and a heat dissipating member disposed on the first side of the carrier structure and on the laminating member
Implementation Method 2
the supporting leg is bonded to the first side of the carrier structure via an adhesive material
Data Source
AI summary
An electronic package is provided. A package module and a semiconductor chip are disposed on a carrier structure, and a laminating member is disposed on the semiconductor chip and the package module. A heat dissipating member is then disposed on the carrier structure and the laminating member. Therefore, by arranging the laminating member, the stress of the carrier structure can be evenly distributed to prevent the problem of delamination from occurring to the semiconductor chip. A manufacturing method of the electronic package is also provided.