Electronic Package Thermal Bridge for Chip Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor packages face poor heat dissipation issues due to the semiconductor chip being surrounded by underfills and encapsulation materials, which hinder efficient heat dissipation, especially in advanced manufacturing processes below 7 nanometers.
Innovation Solution
Incorporating a heat-conducting layer between the non-active surface of the electronic element and a second circuit structure, thermally coupled to the electronic element, to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is surrounded by underfill and encapsulation materials for structural support and electrical connection, then the package structure is complete and functional, but heat dissipation performance deteriorates
Solution Approach 1:
A heat-conducting layer is introduced as an intermediary component between the semiconductor chip and the second circuit structure. This layer serves as a thermal bridge that conducts heat away from the chip without interfering with the structural support function of the underfill and encapsulation materials. The heat-conducting layer is positioned adjacent to the chip's non-active surface, creating a dedicated heat dissipation pathway that does not compromise package integrity.
Solution Approach 2:
The package structure is segmented into distinct functional zones: the underfill and encapsulation materials continue to provide structural support and electrical connections, while the heat-conducting layer is positioned in a separate region adjacent to the chip's non-active surface to handle thermal management. This segmentation allows each component to perform its specialized function without compromising the others.
2Productivity
If advanced manufacturing processes with smaller dimensions are used to improve device performance, then integration density increases, but heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation solution extends into a different spatial dimension by utilizing the non-active surface area of the semiconductor chip. Instead of competing for space on the active surface, the heat-conducting layer is positioned adjacent to the non-active surface, effectively using the third dimension (depth/vertical space) to resolve the heat dissipation challenge associated with high-density integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation capacity by 5%-10%, effectively preventing overheating of the semiconductor chip during operation.
Implementation Method 1
the heat-conducting layer is formed between the non-active surface of the electronic element and the second circuit structure to improve heat dissipation efficiency of the electronic element during operation. The second circuit structure is electrically connected to the first circuit structure and is thermally coupled to the electronic element via the heat-conducting layer.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided. The electronic package includes an electronic element, a photonic element, a first circuit structure, a second circuit structure and a heat-conducting layer. The electronic element has an active surface and a non-active surface opposite to the active surface. The first circuit structure is disposed between the electronic element and the photonic element and is electrically connected to the electronic element and the photonic element. The second circuit structure is electrically connected to the first circuit structure. The heat-conducting layer is formed between the non-active surface of the electronic element and the second circuit structure, and the second circuit structure is thermally coupled to the electronic element via the heat-conducting layer, thereby to improve heat dissipation efficiency of the electronic element during operation.