Coupling Light Guides TRIZ Cases

A tail-sleeve-driven flexible latch lets optical fiber connectors detach cleanly in crowded ports while reducing engaging-member wear and breakage.

An integrated light path and reflecting surface inside the PIC package removes fiber alignment, cutting assembly time, cost, and complexity.

A tail sleeve and auxiliary member enable axial release of the engaging portion, reducing wear and easing optical fiber connector detachment in dense arrays.

An adapter, retainers, and a biasing member align the connector accurately while relieving fiber tension and tolerating lid warpage.

Using SiN passive optics on SOI, this receiver chip cuts insertion loss and temperature drift, avoiding cooling control and lowering cost.

Constructive interference from grating diffraction and surface reflection boosts PIC coupling efficiency while combining spectral filtering in one coupler.

A nested boot latch keeps a fiber optic push-pull boot attached under pull force while saving space in high-density connector assemblies.

A curved optical-device layout with diffraction or refraction separates wavelengths from one fiber, simplifying alignment while adding channels.

Curved mirrors on an ancillary die or in a PIC cavity collimate waveguide light, easing optical alignment and improving coupling yield.

A linear color combinator, reflectors, and waveguide align and mix multi-source light for compact high-resolution wearable displays.

A shared etch flow integrates grating and edge couplers on one PIC, cutting fabrication time and cost while preserving coupling efficiency.

A pivoting splice tray and adapter plate improve adapter access while preserving compact three-layer fiber management and double sealing.

Pre-tested optical fibers are robotically routed on flexible substrates to simplify connector assembly and reduce device waste.

Embedded optical waveguides in a photonic glass substrate replace dense metal interconnects, cutting resistive heating in co-packaged electro-optical chips.

A bonded coupling lightguide and 50% beam splitter coating improve display image uniformity while keeping projector size and weight low.

Integrated securing features let fiber connectors insert directly into a compact multiport, increasing port density without bulky coupling hardware.

Piezoelectric cantilevers align optical fibers in X and Y without frictional stick-slip, improving multi-port optical coupling accuracy.

Polarization-based beam separation and local-oscillator mixing improve LIDAR return coupling despite fast mirror misalignment and signal walk-off.

Glass waveguides on an organic substrate cut polymer coupling loss and temperature drift while improving fiber matching and chip interconnection.

A movable lock arm overlaps the latch when inserted into the adapter, blocking downward movement and preventing accidental optical plug release.

Laser-modified glass waveguides use low-index interfaces for 90-degree optical routing with low loss, compact footprint, and photonic integration.

An MMI waveguide coupler aligns RGB laser beams on one optical axis with lower loss and compact lithium niobate modulator integration.

An optical waveguide routes reflected fingerprint light from multiple screen touch areas to one sensor, improving unlock convenience without extra modules.

An end cap centers the optical fiber during epoxying, prevents adhesion to the housing, and preserves movement to reduce field breakage.

Integrated keyed ports and sliding securing features enable dense optical connections without bulky threaded or bayonet couplings.

A hermetic splice closure integrates PLC or WDM splitters in a factory-built layout to cut OSP congestion, assembly errors, and field rework.

Smaller optical fibers and less reinforcing yarn raise fiber packing density while meeting tensile load needs in compact backbone cables.

A segmented ferrule assembly lets MPO fiber connectors pass through ducts as small as 5.5 mm, then couple with a housing for field termination.

Offset adapter gangs in a stepped 1U layout create finger clearance for plug access while simplifying assembly and reducing space use.

A snap-fit ferrule dust cap protects optical fiber ends from contamination and damage without covering connector sides or falling off.

A conical guide portion and partition wall create wider fiber bending space, reducing seam interference and light loss during field assembly.

Rotatable, axially movable in-line terminals let fiber interfaces be reoriented after installation to correct misalignment and cut data center cabling labor.

A unified optical-electrical connector combines fiber and conductive pin interfaces to simplify installation and reduce plug-in errors.

An oblique fiber-to-PIC package removes complex alignment hardware, cutting manufacturing cost while improving transmit and receive coupling efficiency.

A heat-conducting layer links the chip's non-active surface to a second circuit structure, improving package heat dissipation and preventing overheating.

A cantilever hard-stop constrains pull-handle motion to linear sliding, simplifying transceiver assembly and preventing dislodging during hot swapping.

Interchangeable shrouds, housings, seals, and boots let one pre-terminated fiber cable fit multiple connector styles with secure outdoor sealing.

A CTE-matched glass sheath separates strain relief from sealing, reducing epoxy shrinkage stress and protecting fiber joints under thermal cycling.

Inner-hole projections deform to fill ferrule-receptacle gaps, improving optical alignment accuracy without sacrificing insertion reliability.

A holding member and UV-curable adhesive reduce stress concentration at the PIC-waveguide interface, improving optical coupling reliability.

A planar metasurface replaces bulky lenses between optical fiber and edge coupler, improving mode matching while minimizing aberrations.

A stepped substrate with vertical vias and an optical waveguide packs photonic and logic chips tightly while supporting heat dissipation.

Modal interference in integrated waveguides enables broad-range wavelength locking with phase-shifted outputs that avoid dead zones.

A sealed pulling grip protects pre-terminated fiber ends during high-load cable routing, cutting field splicing time and duct-fit issues.

Deformable housing inner walls constrain ferrule rotation to keep azimuthal alignment stable without adding coupling parts or cost.

By moving the photoelectric conversion component outside the host through an adapter module, this case improves heat dissipation while maintaining reliable electrical connection.

A guide structure shapes cladding by capillary action to balance single-mode guiding, bend loss control, and waveguide protection.

Elliptical 2D grating lines and concave polygon scatterers cut polarization dependent loss while improving waveguide-fiber mode matching.

Multiple luminance captures during fusion splicing are time-weighted to pinpoint the fiber core despite limited microscope resolution.

Combined holographic and polarization gratings create multiple focal planes in an AR waveguide to reduce accommodation-vergence mismatch.

Reflective collimation structures nested in the substrate expand spectral bandwidth and alignment tolerance for photonic chip coupling.

A single-use disposable pod applies a transparent film to fiber ferrule end-faces.

Segmenting isolation across multiple arms resolves narrow bandwidth and high loss trade-offs in integrated photonics.

A field-terminable optical fiber connector uses a mechanical splice device and boot to secure the fiber stub within the housing.

A converging lens focuses light from fiber optic connectors onto a photodetector, resolving alignment precision trade-offs and improving measurement accuracy.

Anti reflective coatings reduce manufacturing sensitivity and prevent etalon effects in photonic integrated circuits.