PIC Package Light Routing Without Fiber Alignment
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Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging is complex, time-consuming, and inefficient due to the need for active alignment of optical fibers with sub-micrometer tolerance, hindering scalability and increasing costs.
Innovation Solution
A package design that incorporates a light propagating portion with a light inlet, reflecting surface, and outlet within the package, utilizing semiconductor materials like silicon to guide light internally without optical fibers, allowing for efficient optical connectivity and hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are used to provide optical input and output functionality, then optical connectivity is achieved, but package assembly time increases and complexity increases due to active alignment requirements
Solution Approach 1:
The patent extracts and eliminates the optical fiber component from the package structure. Instead of using external optical fibers that require active alignment, the invention uses the package substrate itself as the light-guiding medium, integrating the optical function directly into the package structure rather than adding separate optical fiber components.
Solution Approach 2:
The patent merges the optical guiding function with the structural package substrate. The substrate serves dual purposes: providing mechanical support and guiding light from the PIC to the output. This integration eliminates the need for separate optical fibers and their associated alignment mechanisms, significantly reducing assembly time and complexity.
2Reliability
If optical fibers with sub-micrometer tolerance alignment are used, then optical connectivity is achieved, but device complexity increases
Solution Approach 1:
The patent removes the optical fiber component entirely, eliminating the complex alignment system required for sub-micrometer tolerance alignment. The package substrate directly guides the light without requiring external optical components that would increase device complexity.
Solution Approach 2:
The package substrate is designed to perform multiple functions simultaneously: structural support, electrical connection, and optical light-guiding. This multi-functionality eliminates the need for separate optical fiber components and their associated alignment mechanisms, thereby reducing overall device complexity while maintaining optical connectivity.
3Reliability
If epoxy secured fibers are used for optical functionality, then optical input and output are provided, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and removes the optical fiber and epoxy securing components from the manufacturing process. Instead of securing external fibers with epoxy, the invention uses the package substrate's built-in light-guiding structures, eliminating the need for epoxy application and fiber securing operations.
Solution Approach 2:
The patent combines the optical light-guiding function with the structural substrate, eliminating the need for separate optical fiber securing processes. The substrate is manufactured as a single integrated component that provides both mechanical support and optical functionality, significantly simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces package assembly time, cost, and complexity by eliminating the need for optical fibers, enhancing scalability and performance in optical wireless systems and Lidar modules.
Implementation Method 1
the light reflecting surface is arranged at a transverse angle with respect to the propagation direction of the light exiting the PIC, the light reflecting surface reflecting incoming light towards the light outlet
Implementation Method 2
light traveling through air for only a short distance and instead traveling through the material of the package where it scatters less-provided the right packaging material is chosen
Data Source
AI summary
A package for encapsulating a photonic integrated circuit, PIC, the package comprising:a cavity for receiving the PIC, the cavity defined by interior walls of the package;a light propagating portion made of a semiconductor material comprising a light inlet, a light outlet and a light reflecting surface,the light inlet formed by an interior wall of the package that faces a light outlet of the PIC, said interior wall arranged at a semi-perpendicular angle with respect to light exiting the PIC, to allow said light to enter into the light propagating portion of the package,the light reflecting surface arranged at a transverse angle with respect to the propagation direction of the light exiting the PIC so that the light reflecting surface reflects incoming light towards the light outlet;the light outlet formed by an outer surface of the package.