Glass Waveguide Photoelectric Hybrid for Low-Loss Optical Coupling

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Solution Overview

Problem

The high coupling loss and poor temperature stability of polymer waveguides in data center switch systems, along with mismatched refractive indices with optical fibers, lead to increased transmission loss and power consumption, limiting system performance.

Innovation Solution

A photoelectric hybrid device utilizing glass waveguides on organic substrates with integrated conductive traces and photoelectric chips, featuring glass waveguides for optical signal transmission and conductive traces for electrical signals, enhanced by a reflecting mirror for improved optical coupling and refractive index matching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymer waveguide is used for optical interconnection, then manufacturing process compatibility with PCB is improved, but temperature stability deteriorates and transmission loss increases

Engineering Contradiction:
Improvemanufacturing process compatibilityVSAvoidtemperature stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs a composite structure combining organic substrate (for PCB compatibility) with glass waveguide layers (for optical performance). The glass waveguide is formed on the organic substrate through sputtering and chemical vapor deposition, creating a hybrid material system that leverages the advantages of both materials: the organic substrate provides manufacturing compatibility while the glass layer provides temperature stability and low transmission loss.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If polymer waveguide is used for optical interconnection, then manufacturing process compatibility with PCB is improved, but refractive index matching with optical fiber deteriorates

Engineering Contradiction:
Improvemanufacturing process compatibilityVSAvoidoptical coupling loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent controls the refractive index of the glass waveguide by adjusting the composition ratio of SiO2 and GeO2 during chemical vapor deposition. By changing the GeO2 content, the refractive index can be precisely tuned to match that of standard optical fibers, thereby minimizing optical coupling loss while maintaining compatibility with PCB manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If glass waveguide is used for optical interconnection, then temperature stability is improved and refractive index matching is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoidphotoelectric integration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the glass waveguide fabrication process with the existing PCB manufacturing process. The glass waveguide is formed directly on the organic substrate using sputtering and chemical vapor deposition techniques that can be incorporated into standard PCB production lines, thereby reducing overall device complexity despite the advanced materials used.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If long PCB routing distance is used for optical module connection, then optical module assembly is simplified, but transmission line loss increases and power consumption increases

Engineering Contradiction:
Improveoptical module assemblyVSAvoidtransmission line loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent replaces traditional electrical signal transmission through long PCB traces with optical signal transmission through glass waveguides. The glass waveguide is coupled directly to the optical module, eliminating the need for long electrical routing and reducing both transmission line loss and power consumption while maintaining ease of assembly.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances optical coupling and transmission efficiency while maintaining chemical durability and mechanical stability, reducing transmission loss and power consumption, and improving system performance.

Implementation Method 1

a first end of the glass waveguide is provided with a reflecting mirror at a preset angle, and the reflecting mirror is used for reflecting the light incident from a second end of the glass waveguide

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

the reflecting mirror is used for reflecting the light incident from a second end of the glass waveguide to the optical connection port of the photoelectric chip in a direction away from an upper surface of the first organic substrate

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 3

good refractive index matching with optical fiber

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentEP4421548B1Photoelectric hybrid device based on glass waveguide and manufacturing method thereof
Publication Date: 2026.03.25 SHENNAN CIRCUITS
  • EP4421548B1 patent drawingFigure 1~3
  • EP4421548B1 patent drawingFigure 4

AI summary

Provided are a photoelectric hybrid device based on glass waveguide (210) and manufacturing method thereof. The device comprises a first organic substrate (100), a glass substrate (200) and a photoelectric chip (300); an inner side of an upper surface of the glass substrate (200) is provided with a glass waveguide (210) and an electrical interconnection structure communicating the upper surface and a lower surface of the glass substrate (200); the photoelectric chip (300) is installed on an outer side of the upper surface of the glass substrate (200), an electrical connection port of the photoelectric chip (300) is connected with the electrical interconnection structure (220), and an optical connection port of the photoelectric chip (300) is arranged opposite to a first end of the glass waveguide (210); and the lower surface of the glass substrate (200) is connected with the first organic substrate (100), and also connected with the first conductive trace arranged in the first organic substrate (100) through the electrical interconnection structure (220).