Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit
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Solution Overview
Problem
The challenge lies in integrating optical and electrical devices efficiently within integrated circuits to address increasing data traffic demands, as traditional metal interconnects face issues of density, timing, and resistive heating, necessitating a shift towards optical communication technologies.
Innovation Solution
The development of photonic integrated interconnect substrates with optical structures that facilitate communication between electronic and photonic devices, including a substrate with a chip mounting region and fiber connector, and a plurality of optical structures for light transmission, enabling co-packaged optical and electrical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional metal interconnects are used for data transmission, then electrical signals can be transmitted between devices, but density is limited, timing performance degrades, and resistive heating increases
Solution Approach 1:
The patent replaces metal interconnects that transmit electrical signals with optical waveguides that transmit light signals. This substitution eliminates resistive heating in interconnects while enabling higher data transmission speeds through optical communication between the photonic integrated circuit and electronic devices
Solution Approach 2:
The patent changes the transmission medium from electrical conductors to optical waveguides, fundamentally altering the physical parameter of signal transmission from electrical to optical domain. This enables superior performance in speed and energy efficiency
2Speed
If optical fiber technologies are used for long-distance communication, then data transmission speed increases, but integration with electronic circuits becomes complex
Solution Approach 1:
The patent merges photonic and electronic circuits into a single integrated package. The photonic integrated circuit is directly coupled to electronic devices on the same substrate, eliminating the need for separate optical fiber connections and reducing integration complexity while maintaining high-speed optical transmission
Solution Approach 2:
The patent introduces optical waveguides as intermediary structures that bridge the photonic integrated circuit and electronic devices. These waveguides are formed within the substrate and provide a seamless optical transmission path, simplifying the integration between optical and electronic components
3Quantity of substance
If co-packaging of optical and electrical devices is implemented, then metal interconnect reliance decreases and density increases, but manufacturing complexity increases
Solution Approach 1:
The patent segments the system into distinct photonic and electronic functional blocks that are independently fabricated and then integrated. The photonic integrated circuit is fabricated separately and then coupled to electronic devices on the substrate, allowing each component to be optimized independently while achieving high device density
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical interconnection through traces, and optical waveguide integration. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process while achieving high density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances data transmission efficiency by reducing metal interconnect reliance, increasing density, and lowering power consumption, while supporting high-volume manufacturing of optical silicon photonic devices.
Implementation Method 1
a plurality of optical structures between the photonic transceiver chip and the fiber connector with each of the plurality of optical structures being operable to transmit light
Data Source
AI summary
Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to from a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-electrical and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.