Optoelectronic Assembly Integrating Fiber Cables for High-Speed Data Transmission
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Solution Overview
Problem
Conventional copper cables fail to meet the increasing bandwidth requirements and decreasing latency needs of consumer electronics and personal computing due to limitations in data transmission speed, necessitating the use of optical fibers for high-speed data transmission while maintaining electrical compatibility.
Innovation Solution
An optoelectronic assembly comprising a substrate subassembly with an optoelectronic interface IC and optoelectronic components, and a cable subassembly with fiber cables bonded to a lens cover, which includes alignment features and snap features for precise engagement, enabling efficient optical signal conversion and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical fibers are used for data transmission to meet bandwidth requirements, then data transmission speed is improved, but cable structure becomes bulkier due to additional opto-mechanical plug structures
Solution Approach 1:
The patent merges the optical fiber coupling structure directly with the electrical connector housing, eliminating the need for separate opto-mechanical plug structures. The fiber optic cable is integrated within the electrical connector assembly, allowing optical and electrical interfaces to share the same physical envelope, thus reducing overall cable plug volume while maintaining high-speed data transmission capabilities
Solution Approach 2:
The electrical connector housing serves multiple functions: it provides structural support for electrical contacts, houses the optical fiber coupling mechanism, and facilitates both electrical and optical signal transmission. This multi-functional design eliminates redundant structures and reduces the overall cable plug volume while enabling high-speed data transmission
2Device complexity
If conventional copper cables are used for data transmission, then cable structure remains simple, but bandwidth requirement cannot be met due to limitations in data transmission speed
Solution Approach 1:
The cable assembly is segmented into distinct electrical and optical transmission paths within a unified connector housing. The electrical connector portion handles lower-speed signals while the integrated optical fiber portion handles high-speed data transmission, allowing the system to meet bandwidth requirements without requiring a complete redesign of the entire cable structure
Solution Approach 2:
The electrical connector housing acts as an intermediary structure that accommodates both conventional electrical contacts and integrated optical fiber coupling mechanisms. This mediator allows the system to transition from simple copper cable structures to high-speed optical transmission while maintaining compatibility with existing connector standards and simplifying the adoption process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optoelectronic assembly facilitates high-speed data transmission exceeding 10 gigabits per second, providing a compact and efficient solution for active optical cables that meets the bandwidth demands of modern electronics while maintaining compatibility with conventional connectors.
Implementation Method 1
The optoelectronic interface IC may be configured to facilitate the conversion of optical signals to digital electrical signals
Implementation Method 2
The optoelectronic components include at least one laser source and a plurality of photodiodes
Implementation Method 3
A bottom side of the lens cover may include a plurality of optical lens structures, a plurality of alignment pins and a plurality of support pins
Data Source
AI summary
An optoelectronic assembly includes a substrate subassembly and a cable subassembly. The substrate assembly includes a substrate, a holder disposed on the substrate, an optoelectronic interface IC, and a plurality of optoelectronic components. The cable subassembly includes a lens cover and a plurality of fiber cables bonded to the lens cover. The optoelectronic interface IC and the optoelectronic components are disposed in a cavity formed by side walls of the holder. The optoelectronic components include at least one laser source and a plurality of photodiodes. The lens cover is inserted into the cavity and thereby fixedly engaged with the holder.