PIC Beam Collimation Mirrors for Easier Optical Alignment
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Solution Overview
Problem
Efficient and cost-effective alignment of optics to couple light into and out of photonic integrated circuits (PICs) is challenging due to existing methods being expensive and resulting in low yield.
Innovation Solution
Incorporating focusing mirrors, either on a separate ancillary die bonded to the PIC or formed within the PIC, to collimate light from waveguides, reducing alignment requirements for external optics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If V-grooves or fabricating a lens attached to the PIC are used for alignment, then coupling efficiency can be improved, but manufacturing cost increases and yield decreases
Solution Approach 1:
The alignment function is segmented into two independent components: the PIC die and the ancillary die with mirrors. This allows each component to be manufactured separately with optimized processes, then assembled together. The segmentation enables independent optimization of alignment features on each die without compromising the other, reducing overall manufacturing complexity and cost while maintaining precision.
Solution Approach 2:
The ancillary die acts as an intermediary component between the PIC die and external optics. It incorporates curved mirrors that collimate light from the PIC waveguides, providing a standardized optical interface. This intermediary approach decouples the alignment requirements from the external coupling process, allowing the PIC to be manufactured with standard precision while achieving precise optical alignment through the intermediary's specialized features.
2Ease of operation
If focusing mirrors are integrated into the PIC die, then alignment requirements for external optics are reduced, but device complexity increases
Solution Approach 1:
The mirror functionality is segmented onto a separate ancillary die rather than being integrated into the PIC die. This segmentation maintains the simplicity of the PIC die while adding the alignment-functioning mirrors to a dedicated component. The ancillary die can be manufactured with specialized alignment features and then bonded to the PIC, achieving ease of alignment without complicating the core PIC device.
Solution Approach 2:
The ancillary die serves multiple functions: it provides the curved mirrors for light collimation, acts as an alignment reference through its precisely positioned mirrors, and interfaces with external optics. By consolidating these multiple functions into a single ancillary die component, the system achieves ease of alignment while minimizing overall device complexity compared to integrating all functions into the PIC die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution facilitates precise alignment and coupling of light, enhancing the efficiency and yield of PIC operations while reducing costs.
Implementation Method 1
The curved mirrors collimate light from the waveguides
Implementation Method 2
The curved mirrors collimate light from the waveguides into beams
Data Source
AI summary
Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.