Electronic Paper Display Chip-on-Film Bonding Region Design
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Solution Overview
Problem
Existing electronic paper display screens face issues such as slow response speed, complex manufacturing processes, susceptibility to environmental factors like moisture and oxygen, leading to low yield and short lifespan.
Innovation Solution
The electronic paper display screen incorporates a substrate with a display region and a bonding region, featuring an electronic ink conduction portion and a chip-on-film connected to a bonding electrode, which enhances substrate utilization and structural stability through a pixel control circuit on a flexible substrate, along with a transparent electrode layer and conductive adhesive for improved electrical connection and fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bonding methods are used for electronic paper display screens, then manufacturing simplicity is maintained, but substrate utilization rate decreases and structural stability is poor
Solution Approach 1:
The bonding process is segmented into multiple stages: first bonding the chip-on-film to the substrate in the bonding region, then bonding the electronic paper main portion to the substrate in the display region. This staged approach improves structural stability while maintaining manufacturing simplicity by breaking down the complex bonding process into manageable steps.
Solution Approach 2:
The patent extends the bonding region beyond the traditional display region boundaries into adjacent areas of the substrate. By utilizing the extended substrate area for bonding purposes, the structural stability is enhanced without complicating the core display functionality, effectively using spatial dimensionality to resolve the contradiction.
2Reliability
If the chip-on-film is not properly positioned, then manufacturing simplicity is maintained, but electrical connection reliability decreases
Solution Approach 1:
The chip-on-film is pre-positioned and bonded to the substrate in the bonding region before the electronic paper main portion is assembled. This preliminary action ensures proper electrical connection alignment is established early in the manufacturing process, improving connection reliability while maintaining ease of manufacture through a systematic assembly sequence.
Solution Approach 2:
The bonding region acts as an intermediary zone between the chip-on-film and the display region. This intermediate bonding area facilitates proper positioning and electrical connection without complicating the overall assembly process, serving as a mediator that simplifies the integration of different components.
3Productivity
If substrate area is not extended for bonding, then manufacturing simplicity is maintained, but substrate utilization rate decreases
Solution Approach 1:
The substrate serves multiple functions: it acts as both the display region carrier and the bonding region support. By extending the substrate's utility to include bonding functions in adjacent regions, the substrate utilization rate is improved without adding structural complexity, as the substrate itself is already a fundamental component of the display screen.
Data Source
AI summary
Embodiments of the disclosure provide an electronic paper display screen, a display device and a bonding method. The electronic paper display screen includes a substrate, the substrate including a display region and a bonding region on at least one side of the display region and adjacent to the display region, an electronic paper, the electronic paper being disposed in the display region and including an electronic ink conduction portion, the electronic ink conduction portion being at an edge of the electronic paper close to the bonding region and extending to the bonding region of the substrate, a bonding electrode disposed in the bonding region of the substrate, and a chip-on-film, the chip-on-film being electrically connected to the bonding electrode, and an end of the chip-on-film close to the display region being between the substrate and the electronic ink conduction portion.