Electronic Parts Packaging Structure With Homogeneous Resin Embedding
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Solution Overview
Problem
Existing electronic parts packaging structures face reliability issues due to thermal stress caused by differences in thermal expansion coefficients between materials, leading to cracks and contact failures during thermal cycle testing, and may damage components during the manufacturing process.
Innovation Solution
A method involving the formation of uncured resin layers on a substrate, where electronic parts are embedded within an insulating layer made of the same material, using a two-step curing process in a vacuum atmosphere to prevent damage and reduce thermal stress, allowing for the same material to be used for both layers, thus minimizing thermal expansion discrepancies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If underfill resin is used to bond electronic parts to substrate, then bonding strength is improved, but thermal stress causes cracks and contact failures during thermal cycling
Solution Approach 1:
The patent applies homogeneity by making the underfill resin and interlayer insulating layer consist of the same material composition. This eliminates material interface boundaries and ensures uniform thermal expansion characteristics throughout the structure, preventing differential thermal stress that would cause cracking during thermal cycling while maintaining bonding strength.
2Manufacturing precision
If electronic parts are pushed against uncured resin film for embedding, then embedding is achieved, but mechanical damage occurs to weak electronic parts
Solution Approach 1:
The patent changes the physical state parameter of the resin from cured to uncured, transforming it from a rigid material into a viscous, deformable medium. This parameter change allows the resin to flow and conform to the electronic parts under minimal pressure, achieving precise embedding without applying the high forces that would mechanically damage fragile components.
3Adaptability or versatility
If different materials are used for underfill resin and interlayer insulating layer, then functional requirements are met, but thermal expansion difference generates stress
Solution Approach 1:
The patent resolves the contradiction by using the same material for both underfill resin and interlayer insulating layer, creating a homogeneous structure with uniform thermal expansion properties. This eliminates the thermal stress caused by material interfaces while still satisfying functional requirements through proper material selection and layer configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of electronic parts packaging by preventing cracks and contact failures during thermal testing and reduces the risk of component damage during manufacturing, improving the structural integrity and performance of the packaging.
Implementation Method 1
obtaining an insulating layer in which the electronic parts is embedded by curing the first uncured resin layer and the second uncured resin layer by annealing
Implementation Method 2
curing the first uncured resin layer and the second uncured resin layer by annealing in a vacuum atmosphere
Data Source
AI summary
A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts on the first uncured resin layer, forming a second uncured resin layer that covers the electronic parts, and obtaining an insulating layer, in which the electronic parts is embedded, by curing the first uncured resin layer and the second uncured resin layer by annealing.