Electronic Structure Support Layout for Controlled Film Separation
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Solution Overview
Problem
Existing methods for manufacturing electronic structures with composite films face challenges in achieving good separation from substrates, as the area of the anchor is smaller than the electronic structure, leading to potential drooping and adhesion issues.
Innovation Solution
An electronic structure is designed with a substrate, a functional element unit covered by a protector, and a support with a projection, where the support and projection have different materials and areas, allowing for improved separation by adjusting the adhesion forces between the composite film and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the area of the anchor is made smaller than the area of the electronic structure, then the separation can be facilitated, but the electronic structure may droop and adhere strongly to the substrate, degrading the separation
Solution Approach 1:
The support structure is segmented into multiple regions with different adhesion characteristics: a first region with first adhesion strength and a second region with second adhesion strength. This segmentation allows different portions of the electronic structure to have different separation behaviors, preventing drooping while enabling controlled separation.
Solution Approach 2:
Different regions of the support are given different local properties (adhesion strengths) to serve different functions. The first region provides strong adhesion to prevent drooping, while the second region provides weaker adhesion to facilitate separation, creating local quality variations that resolve the contradiction.
2Ease of manufacture
If the area of the anchor is made smaller than the area of the electronic structure, then the separation process can be simplified, but the adhesion force may be insufficient to maintain structural integrity
Solution Approach 1:
The support is divided into multiple regions with different adhesion strengths, allowing the structure to maintain strong overall adhesion while providing localized separation points. This segmentation enables simplified separation processes without compromising overall structural integrity.
Solution Approach 2:
The support uses composite material regions with different adhesion characteristics to the substrate. This composite structure provides both strong adhesion force for structural integrity and controlled weakness for separation, resolving the contradiction between manufacturing ease and strength.
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3F
AI summary
An electronic structure (1) includes: a substrate (10) having a first surface (10A); a functional element unit (2) including a functional element (14R) having an electronic function, and a protector (18) covering the functional element, the functional element unit having a second surface (2B) facing the first surface; a support (11) disposed between the first surface and the second surface, the support supporting the second surface; and a projection (12) disposed on the first surface (10A) of the substrate, the projection projecting toward the functional element unit. The support has a third surface (11A) in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface (12A) in contact with the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.