Electronic Structure Transfer Using Removable Sacrificial Layers
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Solution Overview
Problem
Conventional methods for transferring functional parts from a substrate to another substrate are cumbersome due to the need to remove and handle support layers, which can lead to defects from broken pieces adhering to the transfer substrate.
Innovation Solution
A manufacturing method involving the formation of sacrificial layers and a cover layer to facilitate the easy peeling and transfer of functional parts by removing the sacrificial layers, allowing for a gap between the functional part and the cover layer, enabling smooth transfer without defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a support layer is used to form and transfer the function part, then the function part can be formed on a substrate, but the support layer must be removed after transfer which complicates the process and may cause defects
Solution Approach 1:
The invention extracts the support layer function by replacing it with a sacrificial layer that is completely removed after transferring the function part. This eliminates the need to handle and remove support layers, simplifying the process while avoiding defects from broken support layer pieces.
Solution Approach 2:
The sacrificial layer acts as a temporary intermediary structure that enables the function part to be formed and transferred, then is completely removed. This intermediary approach simplifies the overall process compared to using a permanent support layer that requires manual removal.
2Reliability
If a support layer is peeled off together with the function part, then the function part can be transferred, but broken pieces of the support layer may adhere to the transfer substrate causing defects
Solution Approach 1:
The invention completely extracts and removes the sacrificial layer after it has served its purpose of enabling transfer. This ensures no broken pieces remain on the transfer substrate, eliminating the defect problem associated with support layer removal.
Solution Approach 2:
The sacrificial layer is designed as a temporary, disposable structure that is completely removed after transfer. This approach prioritizes transfer quality by eliminating the risk of broken pieces adhering to the transfer substrate.
3Productivity
If the function part is transferred without removing sacrificial layers, then the transfer process is simplified, but the function part cannot be easily peeled off
Solution Approach 1:
The invention extracts the sacrificial layers completely after transfer, which enables the function part to be easily peeled off from the original substrate. This approach maintains high productivity while ensuring ease of operation during the peeling and transfer steps.
Data Source
AI summary
A manufacturing method of an electronic structure includes forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer. The manufacturing method further includes forming a cover layer extending from the substrate to the second sacrificial layer, and removing the first sacrificial layer and the second sacrificial layer.