High-Aspect Ratio Electroplated Structures for Tight Conductor Pitch
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Solution Overview
Problem
Current electroplating processes for manufacturing circuit structures face challenges in achieving high-aspect ratio electroplated structures with efficient conductor pitch, precision alignment, and reduced stack height, which limits the performance and cost-effectiveness of devices such as coils and motor applications.
Innovation Solution
The method involves forming high-aspect ratio electroplated structures by using a substrate with a metal base and applying a metal crown through electroplating, with techniques such as low current density and high current density plating, conformal and anisotropic plating, and selective metal crown formation to achieve tighter conductor pitch and multiple layers with precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroplating processes are used to manufacture circuit structures, then manufacturing simplicity is maintained, but the ability to achieve high-aspect ratio structures with tight conductor pitch and precision alignment is limited
Solution Approach 1:
The electroplating process is divided into multiple sequential stages: initial conformal plating to build a uniform base layer, followed by selective crown formation on specific regions, and final anisotropic plating to achieve the desired high-aspect ratio structures. This segmentation allows each stage to optimize for its specific function, achieving high precision without requiring a single complex process
Solution Approach 2:
The method performs preliminary conformal plating to create a uniform metal base layer before applying the metal crown. This preliminary action ensures that subsequent selective plating occurs on a perfectly prepared surface, enabling precision alignment and high-aspect ratio formation while keeping the overall process manageable through clear stage separation
2Area of stationary object
If tighter conductor pitch is achieved through electroplating, then device footprint is reduced, but manufacturing difficulty and alignment precision requirements increase
Solution Approach 1:
The electroplating process applies different local qualities to different regions: conformal plating provides uniform coverage on all surfaces, selective crown formation applies metal only to specific elevated regions, and anisotropic plating directs growth primarily in the vertical direction. This local differentiation enables tight conductor pitch with precision alignment, as each region receives the appropriate plating characteristics for its function
Solution Approach 2:
The method transitions from two-dimensional planar patterning to three-dimensional high-aspect ratio structure formation. By building vertical metal crowns and high-aspect ratio conductors, the design utilizes the vertical dimension to achieve tight horizontal pitch while maintaining manufacturing precision through controlled vertical growth rates and selective region targeting
3Productivity
If high current density plating is used to reduce plating time, then productivity increases, but uniformity and precision of the electroplated structures deteriorates
Solution Approach 1:
The electroplating process uses periodic action by alternating between low current density conformal plating stages and high current density selective plating stages. The low current density stages ensure uniform base layer formation, while the high current density stages rapidly build the metal crown and high-aspect ratio structures. This periodic alternation maintains both productivity and precision throughout the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in devices with improved electromagnetic field strength, reduced footprint, and increased performance while being more cost-effective, with 20% more force generated using 30% less power and half the thickness of current technologies.
Implementation Method 1
electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio greater than the aspect ratio of the base
Implementation Method 2
electroplating processes for manufacturing structures such as copper or copper alloy circuit structures
Data Source
AI summary
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.