Liquid Application TRIZ Cases

Ground magnetic paint and multiple sensors improve gait signal detection, cut noise, and deliver richer walking guidance for visually impaired users.

Hybrid core materials and thin insulation enable compact current sensing transformers with low winding ratios, stable high-frequency signals, and AC/DC sensing.

Electroplating fills gaps and cores in rolled-up passive components to cut DC and RF resistance while preserving a compact inductor footprint.

Superparamagnetic metal nanoparticles in an insulating matrix help inductances withstand cryogenic stress and cut high-frequency losses.

Constant electrode spacing, stirring, and reference feedback improve magnetic nanowire length, uniformity, and alloy control for self-biased RF devices.

A three-stage diffusion coating adds heavy rare earths and oxides to raise NdFeB coercivity and resistivity while reducing eddy losses.

Aligned hexaferrite nanoplatelet films avoid high-temperature annealing, enabling magnetic anisotropy and monolithic IC integration.

Metallic ink seals voids in porous SiO2 insulation to raise directional impedance, cut eddy currents, and increase skin depth at low cost.

Wafer processing and electroplating replace hard-material drilling to build smaller, higher-density inductors with greater package flexibility.

Soft ferromagnetic core layers and filled through-holes reduce flux breaks and reluctance, improving voltage-isolated IC package transformers.

A barrier layer isolates magnetic inductor materials from plating solutions, preventing leaching and preserving substrate plating stability.

Selective iron-alloy coatings on wireless charging coils and PCB traces improve inductive coupling, speed charging, and cut material use.

Segmented electroplating with insulating and protective layers suppresses edge horns while preserving high magnetic flux density.

Exposed magnetic particle surfaces let plated vias contact the magnetic resin directly, raising inductance and via reliability.

Sequential conformal and anisotropic electroplating builds aligned high-aspect ratio conductors with tighter pitch and lower stack height.

Porous insulation lets plated magnetic layers break eddy-current paths, enabling smaller high-frequency cores with high BSAT and simpler fabrication.

Controlled Mg content and 36.0% IACS conductivity reduce protruding defects while improving smoothness and proof stress in magnetic disc blanks.

A porous silicon magnetic layer boosts on-chip RF inductance in less area while limiting eddy currents to improve quality factor.

Electric-field deposition forms near-net-shape permanent magnets, cutting machining waste while preserving coercivity through sintering.

A single-step mold and angled seed deposition process forms self-aligned laminated magnetic cores that cut core loss in ultra-miniature devices.

Applying 0.05 to 4.0 A/dm2 for 10 to 180 seconds prevents displacement deposition and excessive oxygen layers, ensuring strong adhesion.

Alloying noble and base metals in the foundation layer suppresses pinhole formation and corrosion during pulse plating.

A printed circuit board embeds a magnetic member within insulating layers, attaching a coil pattern directly to the magnetic surface via adhesive bonding.

Segmented spiral air gaps in electroplated cores reduce thermal hotspots by distributing magnetic flux, improving inductance and reliability.

A magnet member employs a nickel plating film with a sulfur content gradient to improve adhesion and corrosion resistance without chromate coatings.

Segmenting magnetic layers with insulators prevents eddy currents, reducing heat generation and inductance loss in high-frequency micro transformers.

Extraction of inactive matrix components during layer-by-layer deposition maintains crystalline lattice integrity, preventing non-homogeneous deposits.