3D Stacked Coil Inductor Design for Miniaturization
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Solution Overview
Problem
Existing miniaturized inductors face challenges in achieving high electrical characteristics and reliability due to limitations in coil pattern design, particularly in maintaining a fine line width and preventing issues like delamination and voids.
Innovation Solution
A coil component design featuring a support member with through-holes and insulating layers, where the coil pattern has a T-shaped cross-section with a wider upper surface line width and a stacking structure of multiple layers, including a thin film conductor layer that extends to the support member's lower surface and side surfaces, enhancing magnetic flux and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the coil pattern line width is reduced for miniaturization, then the inductor size is reduced, but the electrical characteristics and reliability deteriorate
Solution Approach 1:
The coil pattern transitions from a planar two-dimensional structure to a three-dimensional stacked structure with multiple layers. The first and second coil patterns are disposed at different heights on the support member, connected by via holes. This vertical stacking increases the effective coil area and inductance without increasing the planar footprint, thereby maintaining electrical characteristics while achieving miniaturization.
Solution Approach 2:
The via holes are formed to penetrate through the support member, nesting the connection structure within the support member thickness. The first and second coil patterns are nested at different vertical levels, with the via holes providing electrical connection between them. This nested arrangement maximizes space utilization and maintains electrical performance in a compact form factor.
2Volume of moving object
If the coil pattern line width is reduced for miniaturization, then the inductor size is reduced, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The coil structure is segmented into multiple discrete components: first coil pattern, second coil pattern, and via holes. Each component can be fabricated and positioned independently, allowing for better control of manufacturing precision. The via holes serve as discrete connection points that are easier to manufacture with consistent precision compared to continuous fine-line patterns.
3Reliability
If the coil pattern thickness is increased to improve electrical characteristics, then the inductance increases, but the aspect ratio becomes more difficult to maintain
Solution Approach 1:
Instead of increasing coil pattern thickness in the planar direction, the solution utilizes the vertical dimension by stacking coil patterns at different heights. The first coil pattern is disposed at a first height and the second coil pattern at a second height, with via holes providing vertical connection. This approach increases effective inductance while maintaining a compact overall height, preserving favorable aspect ratio characteristics.
Data Source
AI summary
A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.