Embedded Magnetic PCB Inductor Design for High-Frequency Miniaturization
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Solution Overview
Problem
Current printed circuit boards face challenges in achieving high magnetic permeability at high frequencies and efficient inductance performance due to the increased power supply switching frequency of power management integrated circuits, which requires a high-capacity inductor with a magnetic member, but this often results in increased resistance and larger substrate sizes.
Innovation Solution
A multilayer printed circuit board design incorporating a magnetic member embedded within insulating layers, with a coil pattern attached to the magnetic layer via an adhesive, minimizing the distance between the coil and magnetic member to enhance inductance while also integrating a capacitor for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetic member is added to improve inductance performance, then inductance increases, but DC resistance increases and substrate size increases
Solution Approach 1:
The patent combines the magnetic member and coil pattern into a single integrated structure where the coil pattern is formed directly on the magnetic member surface. This merging eliminates the need for separate adhesive layers and minimizes the distance between the coil and magnetic core, reducing energy loss while maintaining high inductance performance.
Solution Approach 2:
The patent transitions from a traditional three-dimensional inductor structure to a planar two-dimensional structure by forming the coil pattern directly on the magnetic member surface. This dimensional change reduces the overall substrate size and allows for better integration within the PCB layer structure, minimizing resistance while preserving inductance.
2Reliability
If a magnetic member is added to improve inductance performance, then inductance increases, but substrate size increases
Solution Approach 1:
The magnetic member and coil pattern are merged into a single integrated component structure, eliminating the need for separate mounting spaces and adhesive layers. This integration significantly reduces the overall area required on the substrate while maintaining high inductance performance.
Solution Approach 2:
The patent employs a planar configuration where the coil pattern is formed directly on the magnetic member surface, transitioning from a vertical three-dimensional structure to a horizontal two-dimensional structure. This allows the inductor to be embedded within the PCB layer structure, minimizing the substrate area occupied while preserving inductance performance.
3Reliability
If the distance between coil pattern and magnetic member is reduced to improve inductance, then inductance performance improves, but manufacturing complexity increases
Solution Approach 1:
The coil pattern and magnetic member are merged into a single integrated structure formed through a unified manufacturing process. This eliminates the need for separate assembly steps and adhesive application, reducing manufacturing complexity while achieving minimal distance between the coil and magnetic core for optimal inductance performance.
Solution Approach 2:
The magnetic member is prepared in advance with the coil pattern formed directly on its surface before integration into the PCB structure. This preliminary action ensures minimal distance between the coil and magnetic core is achieved automatically through the formation process, eliminating the need for precise post-assembly positioning and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high magnetic permeability and improved inductance performance at high frequencies, reduces DC resistance, and allows for miniaturization and cost-effectiveness by embedding a magnetic member and coil pattern within the circuit board, along with a capacitor for additional functionality.
Implementation Method 1
provides a magnetic member that enhances magnetic permeability at a high frequency
Implementation Method 2
A coil pattern attached to one surface of the magnetic layer of the laminate is formed on at least one of a plurality of the wiring layers via an adhesive
Data Source
AI summary
A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.