Vertical Laminated Magnetic Core Inductor for High Current CMOS Integration

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Solution Overview

Problem

Current technologies lack practical integrated inductors capable of efficiently carrying large current levels with high inductance, low resistance, and high frequency response, which are necessary for advanced microelectronic devices like CMOS integration, especially in small form factors required for compact power conversion and energy-efficient systems.

Innovation Solution

A method of manufacturing inductors with laminated ferromagnetic cores, involving the deposition of conductive seed layers, masking insulator layers, and ferromagnetic layers, with applied magnetic fields to induce easy and hard axes of magnetization, forming a vertically-laminated structure around which a conductive winding is created.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional inductor technologies are used, then manufacturing simplicity is maintained, but the inductors cannot achieve high inductance, low resistance, and high frequency response in small form factors

Engineering Contradiction:
Improveinductor performance precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The magnetic core is segmented into multiple thin ferromagnetic layers separated by insulator layers, creating a laminated structure. This segmentation reduces eddy current losses and enables high frequency response while maintaining high inductance in a compact form factor

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses composite material structure combining ferromagnetic layers with insulator layers to create the laminated core. This composite approach achieves both high inductance through ferromagnetic material properties and low resistance/high frequency response through the insulating barriers that reduce eddy currents

Inventive Principle:
Principle #40Composite materials

2Area of stationary object

If inductor size is reduced for CMOS integration, then area is reduced, but achieving high current carrying capability becomes difficult

Engineering Contradiction:
Improveinductor areaVSAvoidcurrent carrying capability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent transitions from planar inductor designs to vertically-laminated three-dimensional structures. By stacking multiple ferromagnetic layers vertically, the inductor achieves high current carrying capability through increased effective cross-sectional area while maintaining a small planar footprint for CMOS integration

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If high permeability materials are used to increase inductance, then inductance increases, but power loss increases due to eddy currents

Engineering Contradiction:
Improveinductance valueVSAvoidpower loss
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The magnetic path is divided into multiple thin ferromagnetic layers separated by insulator layers. This segmentation interrupts eddy current paths, reducing eddy current losses while maintaining high permeability and inductance through the stacked laminated structure

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The laminated structure creates a effectively porous magnetic core with insulator layers distributed throughout. These insulator layers act as barriers to eddy currents while allowing magnetic flux to pass through the ferromagnetic layers, reducing power loss while maintaining inductance

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of high-quality inductors with improved energy efficiency, reduced power loss, and low inductor current ripple, suitable for high-density CMOS integration and energy-efficient power conversion, addressing the limitations of existing inductor technologies.

Implementation Method 1

applied magnetic fields to induce easy and hard axes of magnetization

Methodology Applied
Scientific EffectMagnetic field induction: Magnetic Field

Implementation Method 2

depositing a plurality of ferromagnetic layers on the exposed portions of the conductive seed layer

Methodology Applied
Scientific EffectFerromagnetism: Ferromagnetism

Implementation Method 3

forming a conductive winding around the laminated ferromagnetic core

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS10347709B2Methods of manufacturing integrated magnetic core inductors with vertical laminations
Publication Date: 2019.07.09 FERRIC INC
  • US10347709B2 patent drawing
  • US10347709B2 patent drawing
  • US10347709B2 patent drawing

AI summary

Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.