Embedded Coil Component with Dual-Melting Point Connection
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Solution Overview
Problem
Existing coil components for electronic devices are not adequately miniaturized, leading to increased thickness and reduced inductive capacity, as they rely on thick substrates and lack efficient methods for thinning while maintaining coil pattern height and uniform turn formation.
Innovation Solution
A coil component design incorporating a magnetic body with an embedded coil portion, featuring internal and external insulating layers, insulating walls, and a connection portion with conductive layers of varying melting points to connect coil patterns, allowing for simultaneous stacking and reduced thickness without compromising coil pattern height or uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional thin-film coil components are used, then miniaturization is achieved, but uniform turn formation of the coil pattern is compromised
Solution Approach 1:
The coil component is segmented into distinct functional layers: insulating layers, coil patterns on opposite surfaces, insulating walls between turns, and connection portions with conductive layers. This segmentation allows each layer to be optimized independently, with the connection portions specifically designed to ensure uniform turn formation by providing structured pathways through the magnetic body.
Solution Approach 2:
Different regions of the coil component have specialized properties: the insulating walls provide localized insulation between turns, the connection portions have specific melting point characteristics for reliable joining, and the magnetic body provides localized magnetic properties. This local quality optimization enables miniaturization while maintaining uniform coil pattern formation through targeted material and structural design in critical regions.
2Length of stationary object
If the coil component is thinned, then miniaturization is achieved, but inductive capacity is reduced
Solution Approach 1:
The invention uses a composite structure combining a magnetic body material with embedded coil patterns and insulating layers. The magnetic body material provides enhanced magnetic properties that compensate for the reduced thickness, allowing the thinned component to maintain or even improve inductive capacity compared to conventional non-magnetic or less-magnetic substrate-based coil components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a thinner coil component with increased inductive capacity by embedding the coil portion in a magnetic body and using conductive layers to connect coil patterns, enabling efficient miniaturization while maintaining coil pattern height and uniformity.
Implementation Method 1
a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other
Data Source
AI summary
A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other.